Saikat Mondal

A novel TSV inductor structure for RF applications

In this paper, we present a positional analysis of a reference ground plane for Through-Silicon-Via (TSV)-based inductor implementation. A new inductor structure is proposed which uses fewer ground planes while still achieving the same functionality. Results were derived from a 3D full wave simulation performed up to 20 GHz.

Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

In this paper, we present a novel through-silicon-via (TSV)-based 3-D inductor structure with ground TSV shielding for better noise performance. In addition, a circuit model is proposed for the inductor, which can reduce the simulation time over finite-element-based 3-D full-wave simulation. Rigorous 3-D full-wave simulation is performed up to 10 GHz to validate the circuit model. The ground TSV-based 3-D inductor is found to be resilient to TSV-TSV crosstalk noise compared with conventional 3-D inductors. The simulation results revealed that more than -33 dB of isolation can be achieved at 2 GHz between the 3-D inductor and the noise probe.

Tunable 3D TSV-based inductor for integrated sensors

This paper describes the design and analysis of 3D through-silicon-via (TSV) inductors for integrated sensor applications. On-chip inductors are an integral part of small foot-print RF and analog chips. In an effort to further reduce foot-print, there have been numerous proposals of 3D TSV inductors. However, these inductors do not maintain higher quality factors due to the lossy silicon substrates through which the TSV must pass. We have designed and simulated a new structure to reduce losses through silicon substrates. Our novel structure tunes the inductors using TSV arrays for low-noise amplifiers. Through our simulation results, we were able to maintain a Q factor of approximately 5 on TSV-based inductors with excellent inductor values.

Development of TSV-based inductors in power electronics packaging

This paper describes the design of a Through-Silicon-Via (TSV) based high-density 3D toroidal type inductor with two different ferromagnetic materials (nickel and Ni-Zn-ferrite) in the core. 3D inductors with different structural dimensions are simulated and compared.

Monitoring and localization of buried plastic natural gas pipes using passive RF tags

A passive harmonic radio frequency (RF) tag on the pipe with added sensing capabilities is proposed in this paper. Radio frequency identification (RFID) based tagging has already emerged as a potential solution for chemical sensing, location detection, animal tagging, etc. Harmonic transponders are already quite popular compared to conventional RFIDs due to their improved signal to noise ratio (SNR). However, the operating frequency, transmitted power and tag efficiency become critical issues for underground RFIDs. In this paper, a comprehensive on-tag sensing, power budget and frequency analyses is performed for buried harmonic tag design. Accurate tracking of infrastructure burial depth is proposed to reduce the probability of failure of underground pipelines. Burial depth is estimated using phase information of received signals at different frequencies calculated using genetic algorithm (GA) based optimization for post processing. Suitable frequency range is determined for a variety of soil with different moisture content for small tag-antenna size. Different types of harmonic tags such as 1) Schottky diode, 2) Non-linear Transmission Line (NLTL) were compared for underground applications. In this study, the power, frequency and tag design have been optimized to achieve small antenna size, minimum signal loss and simple reader circuit for underground detection at up to 5 feet depth in different soil medium and moisture contents.A passive harmonic radio frequency (RF) tag on the pipe with added sensing capabilities is proposed in this paper. Radio frequency identification (RFID) based tagging has already emerged as a potential solution for chemical sensing, location detection, animal tagging, etc. Harmonic transponders are already quite popular compared to conventional RFIDs due to their improved signal to noise ratio (SNR). However, the operating frequency, transmitted power and tag efficiency become critical issues for underground RFIDs. In this paper, a comprehensive on-tag sensing, power budget and frequency analyses is performed for buried harmonic tag design. Accurate tracking of infrastructure burial depth is proposed to reduce the probability of failure of underground pipelines. Burial depth is estimated using phase information of received signals at different frequencies calculated using genetic algorithm (GA) based optimization for post processing. Suitable frequency range is determined for a variety of soil with differ...

A Nonlinear Transmission Line Based Harmonic RF Tag

This paper describes the design and development of a nonlinear transmission line based passive RFID tag. When the tag receives a signal from the interrogator, it generates harmonics which are transmitted back to interrogator. The reflected signal is distorted in time domain due to the harmonic contents. Hence, a change in the rise time would be observed in the received signal. Experimentally, a decrease in rise time by 14% is demonstrated using the wireless tag at a distance of 100mm from the interrogator. The tag was designed to operate in the range of 100 MHz to 500 MHz with Braggs cutoff frequency of 1.2 GHz. This circuit will find applications in tagging, tracking and sensing.

MEMS-Based Tunable TSV Inductors

In this paper, we present a Through-Silicon-Via (TSV)-based 3D tunable inductor for multiple band filter applications. MEMS (Micro Electro-Mechanical Systems)-based switches are implemented to vary inductance by activating and deactivating the switches. MEMS-based switches are fabricated and modeled to implement the tunable inductor. Detailed 3D full-wave simulation results are presented for different frequency bands.

Design of TSV-based Inductors for Internet of Things

This paper describes the design of a Through Silicon Via based high density 3D inductors for Internet of Things (IoT) applications. We present some possible challenges for TSV-based inductors in IoT applications. The current trend towards Internet of Things (IOT), System in Package (SiP) and Package-on-Package (PoP) requires meeting the power requirements of heterogeneous technologies while maintaining minimum package size. 3-D chip stacking has emerged as one of the potential solutions due to its high density integration in a 3D power electronics packaging regime. As an integral part of many power electronics applications, TSV-based inductors are becoming a popular choice because of their high inductance density due to the reduced on-chip footprint compared to conventional planar inductors. Depending on the requirement, values of these inductors could range from a few nanohenries to hundreds of microhenries. Small inductors with a high quality factor are mainly used for RF filter applications, whereas la...

A novel BIST technique for LDMOS drivers

In this paper we describe a novel Built-in-Self-Test (BIST) method using a voltage comparator to detect gate-oxide and drain leakage current for LDMOS by applying a pulse test stimulus. A temperature calibration circuit was also designed for LDMOS-based motor drivers.