Sang Uk Cho

Improving light-emitting diode performance through sapphire substrate double-side patterning

Abstract. Here, we present a new double-side patterned sapphire substrate methodology that improves the efficiency of gallium nitride-light emitting diodes (GaN-LEDs). The light extraction efficiency of GaN-based LEDs was analyzed through the use of a ray-tracing simulation. The extraction efficiency was simulated using patterned sapphire substrate LEDs with a variety of shapes, depths, sizes, and spacing. Through the optimal patterning of the various factors, high extraction efficiency was realized and subsequently improved upon. The thermal LED characteristics were analyzed through the use of the COMSOL general heat transfer module. The LEDs patterned on the sapphire substrate were fabricated using nano imprint lithography. We found that the output power of the double-side patterned LED was 52% greater than that of a flat LED. The thermal resistance of the double side patterned LED was 9.5  K/W less than that found for the flat LED.

A Study on the Imprinting Process for an Optical Interconnection of PLC Device

Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

Integrated optical interconnection for polymeric planar lightwave circuit device using roll-to-roll ultraviolet imprint

Abstract. We propose an integrated structure that combines chip and fiber array blocks for optical interconnection with a polymeric planar lightwave circuit (PLC) device using the roll-to-roll imprint process. The fiber array blocks and PLC chip of the integrated structure are fabricated on the same substrate, and the alignments in the three spatial directions were established with the insertion of an optical fiber. The characteristics of the integrated structure were evaluated by fabricating a 1×2 optical splitter device. The structure had an insertion loss of 3.9 dB, and the optical uniformity of the channel was 0.1 dB, indicating that the same performance for an active alignment can be expected.