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Sangjik Lee

KITECH

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Publication

Featured researches published by Sangjik Lee.

Proceedings of International Conference on Planarization/CMP Technology 2014 | 2014

A study on swing-arm conditioning for enhancing pad lifetime in CMP

Hyunseop Lee; Dasol Lee; Haedo Jeong; Sangjik Lee

A swing-arm conditioning is generally adopted for chemical mechanical polishing (CMP) system to recover the surface roughness of polishing pad. However, the conditioning process results in uneven pad profile. During conditioning, locally excessive pad wear relates to the pad lifetime in CMP process. In this paper we investigate on the relationship of locally controlled swing condition and maximum pad wear during pad conditioning process.

The International Journal of Advanced Manufacturing Technology | 2016

Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing

Sangjik Lee; Hyoungjae Kim; Doyeon Kim; Chuljin Park

International Journal of Precision Engineering and Manufacturing-Green Technology | 2015

The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer

Chuljin Park; Hyoungjae Kim; Sangjik Lee; Haedo Jeong

International Journal of Precision Engineering and Manufacturing-Green Technology | 2015

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Do-Yeon Kim; Hyoungjae Kim; Sangjik Lee; Haedo Jeong

Journal of Mechanical Science and Technology | 2013

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

Hyunseop Lee; Yeongbong Park; Sangjik Lee; Haedo Jeong

Journal of Mechanical Science and Technology | 2016

Characterization of diamond wire-cutting performance for lifetime estimation and process optimization

Do-Yeon Kim; Hyoungjae Kim; Sangjik Lee; Taekyung Lee; Haedo Jeong

Precision Engineering-journal of The International Societies for Precision Engineering and Nanotechnology | 2017

Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal

Hyunseop Lee; Sangjik Lee

International Journal of Precision Engineering and Manufacturing | 2018

Evaluation of Cutting Ability of Electroplated Diamond Wire Using a Test System and Theoretical Approach

Doyeon Kim; Taekyung Lee; Chuljin Park; Sangjik Lee; Haedo Jeong; Hyoungjae Kim

Journal of Mechanical Science and Technology | 2017

Self-dressing effect using a fixed abrasive platen for single-sided lapping of sapphire substrate

Taekyung Lee; Hyoungjae Kim; Sangjik Lee; Chuljin Park; Doyeon Kim; Haedo Jeong

Planarization/CMP Technology (ICPT 2012), International Conference on | 2012

Investigation on Analysis and Design of Pad Conditioning Process in Double Side Polishing

Sangjik Lee; Hyoungjae Kim; Hyunseop Lee; Haedo Jeong

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Collaboration

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Haedo Jeong

Pusan National University

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Hyoungjae Kim

KITECH

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Chuljin Park

KITECH

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Hyunseop Lee

Pusan National University

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Doyeon Kim

KITECH

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Taekyung Lee

KITECH

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Do-Yeon Kim

Pusan National University

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Dasol Lee

Pusan National University

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Yeongbong Park

Pusan National University

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