Sankhya Mohanty

Cellular Scanning Strategy for Selective Laser Melting: Capturing Thermal Trends with a Low-Fidelity, Pseudo-Analytical Model

Simulations of additive manufacturing processes are known to be computationally expensive. The resulting large runtimes prohibit their application in secondary analysis requiring several complete simulations such as optimization studies, and sensitivity analysis. In this paper, a low-fidelity pseudo-analytical model has been introduced to enable such secondary analysis. The model has been able to mimic a finite element model and was able to capture the thermal trends associated with the process. The model has been validated and subsequently applied in a small optimization case study. The pseudo-analytical modelling technique is established as a fast tool for primary modelling investigations.

Cellular scanning strategy for selective laser melting: evolution of optimal grid-based scanning path and parametric approach to thermal homogeneity

Selective laser melting, as a rapid manufacturing technology, is uniquely poised to enforce a paradigm shift in the manufacturing industry by eliminating the gap between job- and batch-production techniques. Products from this process, however, tend to show an increased amount of defects such as distortions, residual stresses and cracks; primarily attributed to the high temperatures and temperature gradients occurring during the process. A unit cell approach towards the building of a standard sample, based on literature, has been investigated in the present work. A pseudo-analytical model has been developed and validated using thermal distributions obtained using different existing scanning strategies. Several existing standard and non-standard scanning methods have been evaluated and compared using the empirical model as well as a 3D-thermal finite element model. Finally, a new grid-based scan strategy has been developed for processing the standard sample, one unit cell at a time, using genetic algorithms, with an objective of reducing thermal asymmetries.

Improving accuracy of overhanging structures for selective laser melting through reliability characterization of single track formation on thick powder beds

Repeatability and reproducibility of parts produced by selective laser melting is a standing issue, and coupled with a lack of standardized quality control presents a major hindrance towards maturing of selective laser melting as an industrial scale process. Consequently, numerical process modelling has been adopted towards improving the predictability of the outputs from the selective laser melting process. Establishing the reliability of the process, however, is still a challenge, especially in components having overhanging structures. In this paper, a systematic approach towards establishing reliability of overhanging structure production by selective laser melting has been adopted. A calibrated, fast, multiscale thermal model is used to simulate the single track formation on a thick powder bed. Single tracks are manufactured on a thick powder bed using same processing parameters, but at different locations in a powder bed and in different laser scanning directions. The difference in melt track widths and depths captures the effect of changes in incident beam power distribution due to location and processing direction. The experimental results are used in combination with numerical model, and subjected to uncertainty and reliability analysis. Cumulative probability distribution functions obtained for melt track widths and depths are found to be coherent with observed experimental values. The technique is subsequently extended for reliability characterization of single layers produced on a thick powder bed without support structures, by determining cumulative probability distribution functions for average layer thickness, sample density and thermal homogeneity.

Cellular scanning strategy for selective laser melting: Generating reliable, optimized scanning paths and processing parameters

Selective laser melting is yet to become a standardized industrial manufacturing technique. The process continues to suffer from defects such as distortions, residual stresses, localized deformations and warpage caused primarily due to the localized heating, rapid cooling and high temperature gradients that occur during the process. While process monitoring and control of selective laser melting is an active area of research, establishing the reliability and robustness of the process still remains a challenge. In this paper, a methodology for generating reliable, optimized scanning paths and process parameters for selective laser melting of a standard sample is introduced. The processing of the sample is simulated by sequentially coupling a calibrated 3D pseudo-analytical thermal model with a 3D finite element mechanical model. The optimized processing parameters are subjected to a Monte Carlo method based uncertainty and reliability analysis. The reliability of the scanning paths are established using cumulative probability distribution functions for process output criteria such as sample density, thermal homogeneity, etc. A customized genetic algorithm is used along with the simulation model to generate optimized cellular scanning strategies and processing parameters, with an objective of reducing thermal asymmetries and mechanical deformations. The optimized scanning strategies are used for selective laser melting of the standard samples, and experimental and numerical results are compared.

Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions

Abstract In contrast to high fidelity CFD codes which require higher computational effort/time, the well-known Resistor-Capacitor (RC) approach requires much lower calculation time, but has a lower resolution of the geometrical arrangement. Therefore, for enclosures without too complex geometry in their interior, it is more efficient to use the RC method for thermal management and design of electronic compartments. Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport into a (closed) electronic enclosure. The developed code has the capability of combining lumped components and a 1D description. Heat and mass transport is based on a FVM discretization of the heat conduction equation and Ficks second law. Simulation results are compared with corresponding experimental findings and good agreement is found. Since, the paper concerns climatic cyclic conditions, a study is accomplished on investigating different material properties (thermal conductivity, diffusivity, solubility) for moisture control inside an enclosure. Further simulations were performed to study the response of temperature and moisture inside an enclosure exposed to the B2 STANAG climatic cyclic conditions. Moreover, the time for moisture build-up inside an enclosure under cyclic conditions is presented for different material properties.

Analysis of moisture transport between connected enclosures under a forced thermal gradient

Nowadays, many electronic products are exposed to harsh climatic conditions, and hence the protection of these devices is a crucial factor in design of systems. Therefore, the modelling tools have become very useful in the electronics design which supports the search of optimal electronics design and humidity control solutions. While high fidelity CFD codes are too time consuming due to computational effort/time, the well-known Resistor-Capacitor (RC) approach has much lower calculation time and is more efficient to use in enclosures without too complex geometry in their interior. Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport. The developed code is used for simulating moisture transport between two boxes/enclosures having different temperatures, connected with a tube of known geometry. It has also the capability of combining a 1D description and lumped components. Here, a FVM discretization of the heat conduction equation and Ficks second law for 1D description is applied to model heat and mass transport. The intention is to predict the amount of moisture transported only via diffusion (convection is neglected in this study) through the tube from the warm to the cold region.

Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Electronic systems are exposed to harsh environmental conditions such as high humidity in many applications. Moisture transfer into electronic enclosures and condensation can cause several problems as material degradation and corrosion. Therefore, it is important to control the moisture content and the relative humidity inside electronic enclosures. In this work, moisture transfer into a typical polycarbonate electronic enclosure with a cylindrical shape opening is studied. The effects of four influential parameters namely, initial relative humidity inside the enclosure, radius and length of the opening and temperature are studied. A set of experiments are done based on a fractional factorial design in order to estimate the time constant for moisture transfer into the enclosure by fitting the experimental data to an analytical quasi-steady-state model. According to the statistical analysis, temperature and the opening length are found as the most significant factors. Based on analysis of variance of the derived time constants, a semi-empirical regression model is proposed to predict the moisture transfer time constant with an adjusted R2 of 0.98; which demonstrated that the model can be used for estimation with a reasonable accuracy. The results show that the temperature has the highest effect on the moisture transfer time constant. Furthermore, the length of the opening is found to be more influential on the moisture transfer time constant at lower temperatures compare to high temperatures, according to the predictions made through the semi-empirical model.

Reducing residual stresses and deformations in selective laser melting through multi-level multi-scale optimization of cellular scanning strategy

Residual stresses and deformations continue to remain one of the primary challenges towards expanding the scope of selective laser melting as an industrial scale manufacturing process. While process monitoring and feedback-based process control of the process has shown significant potential, there is still dearth of techniques to tackle the issue. Numerical modelling of selective laser melting process has thus been an active area of research in the last few years. However, large computational resource requirements have slowed the usage of these models for optimizing the process. In this paper, a calibrated, fast, multiscale thermal model coupled with a 3D finite element mechanical model is used to simulate residual stress formation and deformations during selective laser melting. The resulting reduction in thermal model computation time allows evolutionary algorithm-based optimization of the process. A multilevel optimization strategy is adopted using a customized genetic algorithm developed for optimizing cellular scanning strategy for selective laser melting, with an objective of reducing residual stresses and deformations. The resulting thermo-mechanically optimized cellular scanning strategies are compared with standard scanning strategies and have been used to manufacture standard samples.

Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

Abstract Electronic devices are exposed to a wide range of climatic conditions. This study shows a reliability prediction of electronic devices exposed to different climates (from arid to humid and cold to hot regions). Temperature and humidity probability distribution functions have been calculated to indicate the change of climate exposure along year. While temperature and relative humidity (RH) are important factors in terms of water diffusion and electronic reliability, the internal climatic condition of 25 °C and 60% RH is widely used as threshold for electronic safety. Acceleration factors according to this steady state (25 °C and 60% RH) have been calculated for the different climates, and the protection offered by the enclosures has been estimated under different casing materials and resistor-capacitor (RC) simulation. This method offers a way to predict the average value of failure rate for electronic devices based on climate information and enclosure material.

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Approach DTU Orbit (03/08/2019) Modeling of Moisture Transport into an Electronic Enclosure Using the Resistor-Capacitor Approach The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using the Resistor-Capacitor (RC) method, which is efficient as regards computation time and resources. First, an in-house code is developed to model moisture transport through the enclosure walls driven by diffusion, which is based on the Ficks first and second law. Thus, the model couples a lumped analysis of moisture transport into the box interior with a modified one-dimensional (1D) analogy of Ficks second law for diffusion in the walls. Thereafter, under non-isothermal conditions, the moisture RC circuit is coupled with the same configuration of thermal RC circuit. The paper concerns the study of the impact of imperfections in the enclosure for the whole diffusion process. Moreover, a study of the impact of wall thickness, different diffusion coefficient, and initial conditions in the wall for the moisture transport is accomplished. Comparison of modeling and experimental results showed that the RC model is very applicable for simple and rough enclosure design. Furthermore, the experimental and modeling results indicate that the imperfections, with certain limits, do not have a significant effect on the moisture transport. The modeling of moisture transport under non-isothermal conditions shows that the internal moisture oscillations follow ambient temperature changes albeit with a delay. Although, moisture ingress is slightly dependent on ambient moisture oscillations; however, it is not so dominant until equilibrium is reached.