Saqib Kaleem

On-Orbit Verification of a 4×4 switch matrix for space applications based on the low temperature co-fired ceramics technology

Abstract We have developed a compact, high-performance, mechanically robust reconfigurable microwave switch matrix as well as peripheral components such as diode driver, voltage controlled oscillator, and power detector modules for satellite applications using the low temperature co-fired ceramics technology (LTCC) and hybrid integration of integrated circuits. In order to verify the technology for space applications, we combined these components to build a system that enables automated verification of the switch matrix in space, accounting for power consumption, mass, overall geometrical dimensions, and mechanical robustness. The system passed a full space qualification. During a one year On-Orbit-Verification (OOV) mission aboard the German test satellite TET-1 (technology evaluation carrier) launched on July 22, 2012, the correct operation and reliability of the entire switch matrix system and thereby the used technology will be demonstrated.

An industry-level implementation of a compact microwave diode switch matrix for flexible input multiplexing if a geo-stationary satellite payload

We have developed a electronically reconfigurable 4×4 switch matrix for satellite communications at Ka-band downlink frequencies (17 ... 22 GHz), utilizing low-temperature co-fired ceramic multilayer technology. During a successful one-year on-orbit verification aboard a German test satellite, the switch matrix showed continuous reliable operation and achieved the technology-readiness level (TRL = 9) for low-earth orbit missions. Based on these promising results und underlying qualification capabilities, we have designed an advanced version of the switch matrix as part of a flexible input multiplexer for operation during the entire operational lifetime of the German geo-stationary Heinrich-Hertz mission. The challenge of this approach lies in the combination of latest research concepts with an industry-level space-qualified microwave system-in-package approach including an automated hybrid assembly process, following the highest standards for satellite payload systems. Beside introducing and verifying new technologies in orbit, and thus reducing the design cycles for future satellite payloads in general, increased reproducibility and reliability of the module, and reduced manufacturing costs are further important consequences. The switch matrix incorporates double-sided hybrid integration, hermetic sealing of bare-die components, space-qualified PIN-diode switch-ICs, and wire-bonded coaxial connectors.

Microwave monolithic integrated gallium-nitride switches for low static power reconfigurable switch matrix with passive transparent state for power failure redundancy

Two types of single-pole single-throw microwave monolithic integrated switches based on 0.25 μm GaN-on-SiC technology are presented. These switches constitute an electronically reconfigurable switch matrix with minimal static power dissipation. In addition, these switches establish passive transparent state of the switch matrix, irrespective of the availability of on-board power supply, without requiring additional components on the carrier substrate. Small-signal on-wafer measurements of normally-open absorptive switch with control voltage VC = -5 V demonstrated an insertion loss of (2.4 ± 0.4) dB, an on-to-off isolation of ≥ 60 dB, and a voltage standing wave ratio of 1.44:1 in both transmit and isolation states over the Ka-band downlink 17...22 GHz. The normally-closed reflective switch revealed an insertion loss of ~ 1.5 dB, a voltage standing wave ratio of 1.44:1 and an on-to-off isolation of ≥ 30 dB at VC = -5 V and frequency range 18.2...22.5 GHz.

A package-level implementation of traveling-wave switch using PIN-diodes

A single-pole single-throw switch constituting the transparent path in a reconfigurable switch matrix is presented, improving the availability of the switch matrix in case of an on-board power-fail. The design of the switch is based on the traveling-wave concept using packaged PIN-diodes on a thick-film ceramic substrate under the constraints on the number of PIN-diodes and power dissipation. The circuit design and analysis of the switch based on the concept of an artificial transmissionline are described. Unlike the traditional low-pass characteristics inherent to traveling-wave switches, high isolation is achieved by transforming the parasites of the PIN-diodes in the shunt arms to reveal band-pass characteristics besides assisting the assembly of the package. On-wafer measurements reveal an isolation ≥ 45 dB and an insertion loss ≤ 6 dB in the Ka-band downlink frequencies (17...22 GHz).

Microwave crossovers using cascaded couplers for switching applications

The paper describes a passive solution for the implementation of transparent paths within a reconfigurable switch matrix for satellite communications, to improve its availability in case of power failure. The performance of four cascaded identical reduced-length couplers distributed across embedded layers of a ceramic multi-layer substrate has been presented, fulfilling return-loss, isolation and dimensional requirements. The simulated performance parameters will be verified by measurements in due course.

Reconfigurable 4 × 4 switch matrix for Ka-band Geo-stationary satellite mission

Abstract A 4 × 4 reconfigurable switch matrix based on low temperature co-fired ceramic technology for Geo-stationary satellite mission at Ka-band downlink frequencies (17–22 GHz) is presented. In comparison to its predecessor, the new generation of switch-matrix features augmented functionality whilst an overall reduced size (40%). The distinguished characteristics include the shifting of matching networks from top-layer into the embedded layers of the multilayer ceramic stack and the elimination of two external peripherals required to digitally control the bipolar current sources of the PIN-diodes based switch integrated circuits. As an additional functionality, four passive transparent paths between corresponding input and output are integrated within the module, to exhibit rudimentary transmission through the module in case of on-board power failure.