Sascha Kloetzer

Selective Laser Micro Sintering with a Novel Process

Microparts with a structural resolution of <30μm and aspect ratios of >12 have been generated by selective laser sintering. The technique includes sintering under conditions of vacuum or reduced shield gas pressures. In a novel set-up the material is processed by a Q-switched 1064nm Nd-YAG laser after a special raking procedure. The procedure allows the work pieces to be generated from powders of high melting metals like tungsten as well as lower melting metals like aluminium and copper. Contingent on the parameters, the generated bodies are either firmly attached to the substrate or can be dissevered by a non-destructive method.

Process assembly for μm-scale SLS, reaction sintering, and CVD

A novel device suited for the generation of sintered microparts of metal and ceramics, for reaction sintering and for CVD has been developed and successfully tested. With the production of a functional component it has evidenced professional performance. The set-up is vacuum tight; unstable substances can be processed under various shield gases and pressures; it is equipped with a device suited to rake thin layers of fine powders as well as slurries. Sub micrometer powder can be processed in steps of 1 μm thick sintered layers. In combination with a proprietary sintering regime, micro parts with a structural resolution of <30μm, and aspect ratios of >10 have been achieved.

Laser microsintering of tungsten in vacuum

Laser microsintering of tungsten powder is investigated as a function of laser output power, pulse interval and vacuum level. The intensities are calculated for the evaporation thresholds of tungsten powder particles of various sizes. In addition, the powder layer generation and the resulting layer thicknesses are calculated. The powder abrasion occurring during the process was taken into consideration. Polished sections and REM images were prepared in order to analyse the experimental outcomes. The dependence of sinter density on the parameters is discussed.

High-throughput machining using a high-average power ultrashort pulse laser and high-speed polygon scanner

Abstract. High-throughput ultrashort pulse laser machining is investigated on various industrial grade metals (aluminum, copper, and stainless steel) and Al2O3 ceramic at unprecedented processing speeds. This is achieved by using a high-average power picosecond laser in conjunction with a unique, in-house developed polygon mirror-based biaxial scanning system. Therefore, different concepts of polygon scanners are engineered and tested to find the best architecture for high-speed and precision laser beam scanning. In order to identify the optimum conditions for efficient processing when using high-average laser powers, the depths of cavities made in the samples by varying the processing parameter settings are analyzed and, from the results obtained, the characteristic removal values are specified. For overlapping pulses of optimum fluence, the removal rate is as high as 27.8  mm3/min for aluminum, 21.4  mm3/min for copper, 15.3  mm3/min for stainless steel, and 129.1  mm3/min for Al2O3, when a laser beam of 187 W average laser powers irradiates. On stainless steel, it is demonstrated that the removal rate increases to 23.3  mm3/min when the laser beam is very fast moving. This is thanks to the low pulse overlap as achieved with 800  m/s beam deflection speed; thus, laser beam shielding can be avoided even when irradiating high-repetitive 20-MHz pulses.

High-throughput machining using high average power ultrashort pulse lasers and ultrafast polygon scanner

In this paper, high-throughput ultrashort pulse laser machining is investigated on various industrial grade metals (Aluminium, Copper, Stainless steel) and Al2O3 ceramic at unprecedented processing speeds. This is achieved by using a high pulse repetition frequency picosecond laser with maximum average output power of 270 W in conjunction with a unique, in-house developed two-axis polygon scanner. Initially, different concepts of polygon scanners are engineered and tested to find out the optimal architecture for ultrafast and precision laser beam scanning. Remarkable 1,000 m/s scan speed is achieved on the substrate, and thanks to the resulting low pulse overlap, thermal accumulation and plasma absorption effects are avoided at up to 20 MHz pulse repetition frequencies. In order to identify optimum processing conditions for efficient high-average power laser machining, the depths of cavities produced under varied parameter settings are analyzed and, from the results obtained, the characteristic removal values are specified. The maximum removal rate is achieved as high as 27.8 mm3/min for Aluminium, 21.4 mm3/min for Copper, 15.3 mm3/min for Stainless steel and 129.1 mm3/min for Al2O3 when full available laser power is irradiated at optimum pulse repetition frequency.