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Dive into the research topics where Satoshi Tawara is active.

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Featured researches published by Satoshi Tawara.


Proceedings of SPIE | 1995

Miniature tilting mechanism using piezoelectric actuators

Satoshi Tawara; Takayuki Goto; Kimiyuki Mitsui

A tilting mechanism using piezoelectric actuators which has two rotation degrees of freedom has been developed. The dimensions of the body of the tilting mechanism are 10 mm in diameter and 24 mm in length. We have achieved the following specifications of the tilting mechanism; +/- 20 degree(s) rotational angle in the orthogonal two axes, 30 seconds of the angular resolution, 10 degree(s)/sec of the maximum rotation speed, and 1.75 Nmm of the maximum torque. This paper describes the structure and the experimental results of the linear actuator and the tilting mechanism.


SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems | 2002

Novel fabrication method for 3D microstructures using surface-activated bonding and its application to micro-mechanical parts

Takayuki Yamada; Mutsuya Takahashi; Takashi Ozawa; Satoshi Tawara; Takayuki Goto

The purpose of this work is to demonstrate that a novel fabrication method for 3-D microstructures (FORMULA) is applicable to fabrication of micro mechanical parts with a large flexibility. This method is a kind of layer manufacturing method of thin films for metallic or dielectric microstructures using surface-activated bonding (SAB). The bonding interfaces of thin films are investigated by transmission electron microscope (TEM). Voids were observed at the interfaces of both pure aluminum films and Al-Cu alloy films. The ratio of void on the Al-Cu/Al-Cu interface is much larger than that of Al/Al interface, although the films have the same surface roughness of 3nm in Ra (average roughness). And approximately 10nm-thick amorphous intermediate layers were found at the interfaces. Furthermore, we have fabricated a micro gear of 900μm in diameter and 200μm in height, which is about ten times as large as our previous test pieces. Overhung structures such as a bridge structure and a cantilever were also fabricated without supporting layers beneath them.


Archive | 2008

Cold joining device

Takeshi Tsuno; Takayuki Goto; Masato Kinouchi; Satoshi Tawara; Jun Utsumi; Yoichiro Tsumura; Kensuke Ide; Takenori Suzuki


Archive | 2005

Manufacturing system for microstructure

Takeshi Tsuno; Takayuki Goto; Satoshi Tawara; Masato Kinouchi; Shin Asano; Osamu Hasegawa; Takayuki Yamada; Mutsuya Takahashi


Archive | 2004

Device for manufacturing micro-structure

Shin Asano; Noburo Goto; Takayuki Goto; Osamu Hasegawa; Masahito Kinouchi; Mutsuya Takahashi; Satoshi Tawara; Takeshi Tsuno; Takayuki Yamada; 高幸 山田; 信朗 後藤; 崇之 後藤; 雅人 木ノ内; 武志 津野; 伸 浅野; 諭 田原; 修 長谷川; 睦也 高橋


Archive | 2006

NORMAL-TEMPERATURE BONDING APPARATUS

Shin Asano; Takayuki Goto; Kensuke Ide; Masahito Kinouchi; Kiten Suzuki; Satoshi Tawara; Yoichiro Tsumura; Takeshi Tsuno; Atsushi Uchiumi; 健介 井手; 淳 内海; 崇之 後藤; 雅人 木ノ内; 陽一郎 津村; 武志 津野; 伸 浅野; 諭 田原; 毅典 鈴木


Archive | 2008

Wafer bonding apparatus

Satoshi Tawara


Archive | 1999

Grinding swarf collector

Yasuhiro Kanai; Hiroshi Yasukura; Satoshi Tawara


Archive | 1998

Ground chip collecting device

Yasuhiro Kanai; Satoshi Tawara; Hiroshi Yasukura; 宏 安倉; 諭 田原; 康弘 金井


Archive | 2008

ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD

Masato Kinouchi; Takayuki Goto; Satoshi Tawara; Takeshi Tsuno; Jun Utsumi; Kensuke Ide; Takenori Suzuki

Collaboration


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Takayuki Goto

Mitsubishi Heavy Industries

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Takeshi Tsuno

Mitsubishi Heavy Industries

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Masato Kinouchi

Mitsubishi Heavy Industries

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Kensuke Ide

Mitsubishi Heavy Industries

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Shin Asano

Mitsubishi Heavy Industries

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Jun Utsumi

Mitsubishi Heavy Industries

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Takenori Suzuki

Mitsubishi Heavy Industries

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