Saule Kudaikulova

New Metalized Polyimide Films Structure and Physical Properties

The classical techniques of PI film metallization by either vapour deposition or electrochemical reduction of metals involve necessary technological steps such as polymer surface modification via plasma or ion beam, electron beam, or photolytic treatment, or surface sensitization by the conferment of catalytic properties, in order to enhance metal- PI adhesion, which is the main problem to be overcome in all processes. The technology presented differs by the use of another chemical approach yielding electro-conductive materials with high reflectivity, but without damaging the films in the process. The metalized polyimide films have been prepared by hetero- geneous chemical modification of the polyimide surface and the suggested technology includes several chemical conver- sion steps (hydrolysis, chelating by metal salts and reduction) requiring no complicated procedures and proceeding under mild conditions, at room temperature and without aggressive agents. This new process allows the formulation of metal phase while both simplifying the technology and making use of commercial PI films, such as Kapton  HN and Upilex  S.