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IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 1992

Thermal enhancements for a thin film chip carrier

Scott David Reynolds; Bahgat Sammakia; Timothy F. Carden

The development of a thermal enhancement technique targeted for single-chip, thin-film carriers is described. The test package consisted of a 7.5-mm by 7.5-mm chip bonded to a high lead count organic tape substrate using tape automated bonding (TAB). Because of high chip power requirements, a thermal enhancement consisting of a heat sink bonded to the chip with a thermally conductive epoxy was developed. The objectives were to develop the appropriate heat sink, thermal adhesive, and assembly process for the heat management system. The thermal performance of the package was evaluated in both natural and forced convection environments. Reliability measurements were taken to ensure the chip to heat sink interface and the overall package withstood the required stresses without significant performance deterioration. These stresses included standard accelerated thermal cycling (ATC), ship shock, mechanical torque and vibration, and chemical exposure. >


Archive | 1990

Pluggable electronic circuit package assembly with snap together heat sink housing

Joseph Funari; Terence Carl Godown; Scott David Reynolds; Bahgat Sammakia


Archive | 1993

Method and apparatus for testing of integrated circuit chips

Morris Anschel; Anthony P. Ingraham; Charles Robert Lamb; Michael David Lowell; Voya R. Markovich; Wolfgang Mayr; Richard Gerald Murphy; Mark V. Pierson; Tamar Alane Powers; Timothy Shawn Reny; Scott David Reynolds; Bahgat Sammakia; Wayne Russell Storr


Archive | 1989

Electronic package with improved heat sink

Joseph Funari; Mary Cerny Green; Scott David Reynolds; Bahgat Sammakia


Archive | 1993

Attachment for contacting a heat sink with an integrated circuit chip and use thereof

Scott David Reynolds


Archive | 2008

MATCHING LEARNING OBJECTS WITH A USER PROFILE USING TOP-LEVEL CONCEPT COMPLEXITY

Jacob Couch; Jeremy K. Espenshade; Scott David Reynolds; Curtis Stratman


Archive | 1994

Verfahren und Apparat zum Testen von integrierte Schaltungchips

Morris Anschel; Anthony P. Ingraham; Charles Robert Lamb; Michael David Lowell; Voya R. Markovich; Wolfgang Mayr; Richard Gerald Murphy; Mark V. Pierson; Tamar Alane Powers; Timothy Shawn Reny; Scott David Reynolds


Archive | 1991

Electronic circuit package assembly and radiating device which can be inserted into edge-type connector

Joseph Funari; Terence Carl Godown; Scott David Reynolds; Bahgat Sammakia


Archive | 1991

Steckbare paketförmige elektronische Schaltkreisanordnung mit einschnappbarem Wärmesenken-Gehäuse

Joseph Funari; Terence Carl Godown; Scott David Reynolds; Bahgat Sammakia


Archive | 1989

Electronic package with pliant heat sink

Joseph Funari; Mary Cerny Green; Scott David Reynolds; Bahgat Sammakia

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