Se-young Oh
Samsung
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Se-young Oh.
international electronics manufacturing technology symposium | 1999
Tae-Je Cho; Eun-Chul Ahn; Ju-Hyun Lyu; M.G. Chung; Se-young Oh
In order to assemble a chip scale package (CSP), a die with centralized bonding pads was mounted on a printed circuit board (PCB) using adhesive film, and was wire-bonded through a slot formed along the PCB center area, followed by encapsulation. After solder ball attachment, a PCB strip was divided into individual packages by punching. As the whole process is available with current equipment and materials, the assembly cost for this CSP is very low. The package height is lower than 1.0 mm, and the body size is larger than the die size only by 0.4 mm at each side. The ball pitch and size are 0.75 mm and 0.35 mm, respectively. The ball matrix was depopulated at the center area by two rows, leaving sufficient space for wire bonding. The package has passed reliability tests, including the level 3 preconditioning test, 240 hours of pressure cooker tests, and 1000 cycles of temperature cycling at board level as well as at component level. Through this work, it was has been verified that this CSP is one of the most cost-effective CSP solutions for DRAM devices.
Transactions of The Korean Society of Mechanical Engineers B | 2007
You-Seop Lee; Sang-Kwon Wee; Se-young Oh; Jae-Woo Chung
This paper presents numerical and theoretical studies of acoustic wave interactions in slightly compressible liquids within piezoelectrically driven inkjet print heads. The interconnected flow channels may cause jet crosstalk, resulting in poor printing quality. It should be reduced by modifying the channel structure with the acoustic wave interactions considered. Compressible gas flow driven by the sudden movement of a top wall in the channel is calculated using Flow3D and is validated with the narrow gap theory. Limited compressibility model of the Flow3D is employed to calculate pressure waves of slightly compressible ink flow. It is found that reducing restrictor width can damp out the jet crosstalk by inhibiting the pressure wave propagation. The degree of crosstalk has been quantified using the maximum values of cross-correlations between neighboring channels and a critical channel dimension for acceptable crosstalk has been proposed. This finding is verified by drop visualization experiments using silicon-micromachined piezo inkjet print heads that are fabricated by our group.
Archive | 2007
Sung-gyu Kang; Young-ki Hong; Jae-Woo Chung; Se-young Oh
Archive | 2005
Seog-Soon Baek; Min-Soo Kim; Kye-Si Kwon; Se-young Oh; Mi-Jeong Song; Gee-young Sung; 世榮 呉; 美貞 宋; 基榮 成; 啓示 權; 錫淳 白; ▲ミン▼秀 金
Archive | 2007
Sang-Kwon Wee; Se-young Oh; Jae-Woo Chung; Mi-Jeong Song
Archive | 2005
Gee-young Sung; Min-Soo Kim; Kye-Si Kwon; Se-young Oh; Seog-Soon Baek; Mi-Jeong Song
Archive | 2007
Se-young Oh; Sang-Kwon Wee; Mi-Jeong Song
Archive | 2007
Sang-Kwon Wee; Se-young Oh; Jae-Woo Chung
Archive | 2010
Hong-Kyun Ahn; Se-young Oh
Archive | 2016
Yong-Woo Lee; Chang-heon Yoon; Jong-min Kim; Sang-Hun Park; Sung-Min So; Wha-seob Sim; Se-young Oh