Seimi Sasaki

High power and high sensitivity planar lightwave circuit module incorporating a novel passive alignment method

A high-power, high-sensitivity planar lightwave circuit (PLC) module, comprising a laser diode (LD) and a photodiode (PD) surface mounted on a PLC platform, has been realized by a novel passive alignment technique. We used a spot-size transformed LD and a corner-illuminated PD to form a highly efficient optical coupling between the devices and a PLC waveguide. We used the unique marker alignment method to ensure accurate positioning of them. The positioning precision achieved in the lateral direction was within 1 /spl mu/m for the LDs and within 10 /spl mu/m for the PDs. The rotational precision was within 0.4/spl deg/ for both chips. We realized high power operation (>8 mW) with a high receiver sensitivity (0.3 A/W). In this paper, we describe a high power, high sensitivity PLC incorporating a novel passive optical alignment technique for LDs and PDs.

Lens-coupled laser diode module integrated on silicon platform

Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTTH). For these systems to be viable, the optical module assemble costs and package size must process of finding the optimum optical coupling position. In addition, the number and size of parts cannot be reduced due to the difficulty of manipulating them. As a new approach for a lower cost, compact packaging solution, silicon platform technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-diode, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment.

High power and high sensitivity PLC module using a novel corner-illuminated PIN photodiode

A high power, high sensitivity PLC module, comprising an LD and a PD surface mounted on a PLC platform, has been realized by a novel passive alignment technique. We used a spot-size transformed LD and a corner-illuminated PD to form a highly efficient optical coupling between the devices and a PLC waveguide. We used the unique marker alignment method to ensure accurate positioning of them. The positioning precision achieved in the lateral direction was within 1 /spl mu/m for the LDs and within 10 /spl mu/m for the PDs. The rotational precision was within 0.4 degrees for both chips. We realized high power operation (>8 mW) with a high receiver sensitivity (0.3 A/W). In this paper, we describe a high power, high sensitivity PLC incorporating a novel passive optical alignment technique for LDs and PDs.

Screen printed adhesive technologies for all-silicon optical packaging

An all-silicon optical packaging method is a promising candidate for compact, low cost optical modules. In our previous work, we demonstrated a silicon packaged laser module that was sealed with adhesive. However, our adhesive sealing process yield was not high. In this paper, a screen printing technique is proposed as a new approach to improve the adhesive process. This screen printing method allows for better module fabrication stability. The productivity is also improved with a yield of more than 90% in all assembly processes. Moreover, stable optical coupling over a wide temperature range and good sealing characteristics have been obtained.