Sen Mao

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Complete power management system implemented in a single surface mount package

Method for fabricating stack die package

Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture

Leadframe having slots in a die pad

Semiconductor package and method

Halbleiterpaket und verfahren dafür

Vollständiges Leistungsverwaltungssystem in einer einzelnen oberflächenmontierten Packung

System zur kompletten leistungsverwaltung in einem einzelnen oberflächenmontierten paket

A semiconductor device comprising a chip which is arranged between a cup-shaped printed circuit board and a circuit board having mesas and valleys, and methods for its preparation