Sen Mao | Researchain

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Publication

Featured researches published by Sen Mao.

Archive | 2004

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Mohammed Kasem; King Owyang; Frank Kuo; Serge Robert Jaunay; Sen Mao; Oscar Ou; Peter Wang; Chang-Sheng Chen

Archive | 2006

Complete power management system implemented in a single surface mount package

King Owyang; Mohammed Kasem; Yuming Bai; Frank Kuo; Sen Mao; Sam Kuo

Archive | 2013

Method for fabricating stack die package

Kyle Terrill; Frank Kuo; Sen Mao

Archive | 2010

Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture

Serge Robert Jaunay; Suresh Belani; Frank Kuo; Sen Mao; Peter Wang

Archive | 2001

Leadframe having slots in a die pad

Frank Kuo; Sen Mao; Sam Kuo; Oscar Ou

Archive | 2010

Semiconductor package and method

Serge Robert Jaunay; Suresh Belani; Frank Kuo; Sen Mao; Peter Wang

Archive | 2010

Halbleiterpaket und verfahren dafür

Serge Robert Jaunay; Suresh Belani; Frank Kuo; Sen Mao; Peter Wang

Archive | 2006

Vollständiges Leistungsverwaltungssystem in einer einzelnen oberflächenmontierten Packung

King Owyang; Frank Kuo; Sam Kuo; Mohammed Kasem; Sen Mao; Yuming Bai

Archive | 2006

System zur kompletten leistungsverwaltung in einem einzelnen oberflächenmontierten paket

King Owyang; Frank Kuo; Sam Kuo; Mohammed Kasem; Sen Mao; Yuming Bai

Archive | 2005

A semiconductor device comprising a chip which is arranged between a cup-shaped printed circuit board and a circuit board having mesas and valleys, and methods for its preparation

Mohammed Kasem; Frank Kuo; Serge Robert Jaunay; Sen Mao; Oscar Ou; Peter Wang; Chang-Sheng Chen

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Collaboration

Dive into the Sen Mao's collaboration.

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Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot

Dive into the research topics where Sen Mao is active.

Publication

Featured researches published by Sen Mao.

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Complete power management system implemented in a single surface mount package

Method for fabricating stack die package

Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture

Leadframe having slots in a die pad

Semiconductor package and method

Halbleiterpaket und verfahren dafür

Vollständiges Leistungsverwaltungssystem in einer einzelnen oberflächenmontierten Packung

System zur kompletten leistungsverwaltung in einem einzelnen oberflächenmontierten paket

A semiconductor device comprising a chip which is arranged between a cup-shaped printed circuit board and a circuit board having mesas and valleys, and methods for its preparation

Collaboration

Dive into the Sen Mao's collaboration.