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Seong-Chan Han

Samsung

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Publication

Featured researches published by Seong-Chan Han.

Archive | 2001

Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof

Seong-Chan Han; Dong-Woo Shin; Dong-Chun Lee; Wang-Jae Lee

Archive | 2009

Semiconductor packaging device

Dong-Woo Shin; Seong-Chan Han; Sun-Kyu Hwang; Hyun-Jong Oh; Nam-Yong Oh

Archive | 2010

METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY MODULE

Nam-Yong Oh; Seong-Chan Han; Jae-Young Kim; Jae-Hoon Choi

Archive | 2007

REWORKABLE PASSIVE ELEMENT EMBEDDED PRINTED CIRCUIT BOARD

Hyo-Jae Bang; Dong-Chun Lee; Seong-Chan Han; Jun-Young Lee; Jung-hyeon Kim

Archive | 2011

Semiconductor Module Socket Apparatus

Joo-Han Lee; Jung-Hoon Kim; Seong-Chan Han

Archive | 2011

Test Socket for Testing Electrical Characteristics of a Memory Module

Jung-Hoon Kim; Yong-Hyun Kim; Seong-Chan Han; Kwang-Su Yu; Jae-Seon Hwang

Archive | 2011

Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly

Jung-Hoon Kim; Seong-Chan Han; Dong-Chun Lee; Jae-Hoon Choi; Sun-Kyu Hwang

Archive | 2010

ARRAY RESISTOR AND METHOD OF FABRICATING THE SAME

Seong-Chan Han; Jae-Young Kim; Kwang-Su Yu

Archive | 2007

Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same

Hyo-Jae Bang; Heui-Seog Kim; Seong-Chan Han; Jung-hyeon Kim; Sung-Hwan Kim

Archive | 2006

Printed circuit board of semiconductor package and method for mounting semiconductor package using the same

Seong-Chan Han; Dong-Chun Lee; Kwang-Su Yu; Dong-Woo Shin; Hyo-Jae Bang; Hyun-Seok Choi; Si-Suk Kim

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Collaboration

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Dong-Chun Lee

Samsung

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Hyo-Jae Bang

Samsung

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Dong-Woo Shin

Samsung

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Jung-Hoon Kim

Samsung

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Kwang-Su Yu

Samsung

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Sun-Kyu Hwang

Samsung

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Jung-hyeon Kim

Samsung

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Nam-Yong Oh

Samsung

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Young-Soo Lee

Samsung

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Jae-Hoon Choi

Samsung

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