Serge Gourrier

High quality plasma planarization: methodology and application to maskless selective interconnection

Abstract Reliable and tunable plasma planarization processes result from an extensive modelling of the sacrificial layer planarization efficiency as well as the back etching uniformity and selectivity. In addition a new maskless selective interconnect technique with unequaled packing density potential is demonstrated.

Resist profile control of image reversal process in contact lithography

Abstract Image reversal with AZ 5214 resist is characterized by contact lithography, using a statistical experimental approach. Overhanging and quasi vertical profiles which are of particular interest in GaAs technology (lift-off and anisotropic etching processing) are obtained simply by varying the UV3 exposure dose and submicron features are achieved with a low dispersion (3 σ = 0.12 μm) using a thick resist.