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Dive into the research topics where Setsuo Ando is active.

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Featured researches published by Setsuo Ando.


electronic components and technology conference | 1995

Stable non-cyanide electroless gold plating which is applicable to manufacturing of fine pattern printed wiring boards

Takashi Inoue; Setsuo Ando; Hiroaki Okudaira; J. Ushio; A. Tomizawa; H. Takehara; T. Shimazaki; H. Yamamoto; H. Yokono

Highly stable non-cyanide electroless gold plating baths have been developed, which are applicable to manufacturing of fine pitch printed wiring board. Monovalent gold ion (gold source) is stabilized by thiosulfate and sulfite ligands instead of conventional toxic cyanide ligand. The bath stability of the basic formulation which uses thiourea as a reducing agent has been exceedingly enhanced by introducing the new concept of reducing agent regenerator that recycles oxidized products from the reducing agent back to original thiourea again. The finally improved bath offers good quality soft gold deposit by safe, neutral, low temperature and very stable plating condition.


Archive | 2010

Aluminum porous material and its manufacturing method, and power storage device using the aluminum porous material as electrode current collector

Setsuo Ando; Keiichi Itakura; Atsushi Okamoto; Koji Sato; Masaaki Shimada; Shinichiro Yokoyama; 光司 佐藤; 節夫 安藤; 篤志 岡本; 正明 嶋田; 慶一 板倉; 紳一郎 横山


Archive | 1988

Electronic device plated with gold by means of an electroless gold plating solution

Jiro Ushio; Osamu Miyazawa; Akira Tomizawa; Hitoshi Yokono; Naoya Kanda; Naoko Matsuura; Setsuo Ando; Hiroaki Okudaira


Archive | 1994

MANUFACTURE OF THIN-FILM CIRCUIT BY PERIODIC REVERSE ELECTROLYZING METHOD AND THIN-FILM CIRCUIT BOARD, THIN-FILM MULTILAYER CIRCUIT BOARD AND ELECTRONIC CIRCUIT DEVICE USING THE SAME

Setsuo Ando; Takashi Inoue; Toshimitsu Noguchi; Takayoshi Watabe; 隆史 井上; 節夫 安藤; 隆好 渡部; 利光 野口


Archive | 1990

Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same

Jiro Ushio; Osamu Miyazawa; Akira Tomizawa; Hitoshi Yokono; Naoya Kanda; Naoko Matsuura; Setsuo Ando; Hiroaki Okudaira


Archive | 2001

Electrolytic copper-plated R-T-B magnet and plating method thereof

Setsuo Ando; Minoru Endoh; Tsutomu Nakamura; Toru Fukushi


Archive | 2007

Aluminum plating layer, metallic member and manufacturing method therefor

Setsuo Ando; Hiroyuki Hoshi; Atsushi Okamoto; 節夫 安藤; 篤志 岡本; 裕之 星


Archive | 2006

ALUMINUM ELECTROPLATING SOLUTION AND ALUMINUM PLATING FILM

Setsuo Ando; Atsushi Okamoto; 節夫 安藤; 篤志 岡本


Archive | 2001

Coated r-t-b magnet and method for preparation thereof

Hiroyuki Hoshi; Setsuo Ando


Archive | 1994

Thin film multilayered circuit board and its manufacture

Setsuo Ando; Takashi Inoue; Masakazu Ishino; Michifumi Kawai; Masayuki Kyoi; Hidemi Sato; Ryohei Sato; Fusaji Shoji; Tetsuya Yamazaki; Tomoko Yoda; 隆史 井上; 正之 京井; 了平 佐藤; 秀己 佐藤; 智子 依田; 節夫 安藤; 哲也 山崎; 房次 庄子; 通文 河合; 正和 石野

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