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Dive into the research topics where Seungchoun Choi is active.

Publication


Featured researches published by Seungchoun Choi.


Laboratory for Manufacturing and Sustainability | 2010

Machine Tool Design and Operation Strategies for Green Manufacturing

Nancy Diaz; Seungchoun Choi; Moneer Helu; Yifen Chen; Stephen Jayanathan; Yusuke Yasui; Daeyoung Kong; Sushrut Pavanaskar; David Dornfeld


Journal of Manufacturing Systems | 2011

Software-based tool path evaluation for environmental sustainability

Daeyoung Kong; Seungchoun Choi; Yusuke Yasui; Sushrut Pavanaskar; David Dornfeld; Paul K. Wright


Procedia Engineering | 2011

A model of material removal and post process surface topography for copper CMP

Seungchoun Choi; Fiona M. Doyle; David Dornfeld


ECS Journal of Solid State Science and Technology | 2017

Material Removal Mechanism during Copper Chemical Mechanical Planarization Based on Nano-Scale Material Behavior

Seungchoun Choi; Fiona M. Doyle; David Dornfeld


ECS Journal of Solid State Science and Technology | 2017

Editors' Choice—Efficiency of a CMP Pad at Removing Protective Material from Copper during CMP

Seungchoun Choi; Fiona M. Doyle; David Dornfeld


Journal of The Electrochemical Society | 2013

Influence of Copper Ion Concentration on the Kinetics of Formation of a Protective Layer on Copper in an Acidic CMP Solution Containing BTA and Glycine

Seungchoun Choi; David Dornfeld; Fiona M. Doyle


Archive | 2011

A model of material removal and post process surface topography for copper CMP - eScholarship

Seungchoun Choi; Fiona M. Doyle; David Dornfeld


Laboratory for Manufacturing and Sustainability | 2010

Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4

Seungchoun Choi; Shantanu Tripathi; David Dornfeld; Fiona M. Doyle


Laboratory for Manufacturing and Sustainability | 2009

Integrated Tribo-Chemical Modeling of Copper CMP

Shantanu Tripathi; Seungchoun Choi; Fiona M. Doyle; David Dornfeld

Collaboration


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David Dornfeld

University of California

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Fiona M. Doyle

University of California

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Daeyoung Kong

University of California

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Yusuke Yasui

University of California

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Moneer Helu

University of California

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Nancy Diaz

University of California

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Paul K. Wright

University of California

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