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Sheila Marie L. Alvarez

STATS ChipPAC Ltd

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Archive | 2005

Semiconductor package flip chip interconnect having spacer

Jae Soo Lee; Geun Sik Kim; Sheila Marie L. Alvarez; Robinson Quiazon; Hin Hwa Goh; Frederick Rodriguez Dahilig

Archive | 2003

Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

Il Kwon Shim; Seng Guan Chow; Virgil Cotoco Ararao; Sheila Marie L. Alvarez; Roger Emigh

Archive | 2007

Etched leadframe flipchip package system

Il Kwon Shim; Sheila Marie L. Alvarez; Hin Hwa Goh; Robinson Quiazon

Archive | 2013

Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP

Pandi C. Marimuthu; Sheila Marie L. Alvarez; Yaojian Lin; Jose Alvin Caparas; Yang Kern Jonathan Tan

Archive | 2011

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

Frederick Rodriguez Dahilig; Sheila Marie L. Alvarez; Antonio B. Dimaano; Dioscoro A. Merilo

Archive | 2004

Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor

Tie Wang; Virgil Cotoco Ararao; Il Kwon Shim; Sheila Marie L. Alvarez

Archive | 2006

Integrated circuit package system with downset lead

Jeffrey D. Punzalan; Sheila Marie L. Alvarez; Jose Alvin Caparas; Robinson Quiazon

Archive | 2012

Integrated circuit packaging system with support structure and method of manufacture thereof

HeeJo Chi; Bartholomew Liao Chung Foh; Sheila Marie L. Alvarez; Zigmund Ramirez Camacho; Dao Nguyen Phu Cuong

Archive | 2008

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Il Kwon Shim; Hun Teak Lee; Sheila Marie L. Alvarez; Gyung Sik Yun; Heap Hoe Kuan

Archive | 2005

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Il Kwon Shim; Sheila Marie L. Alvarez; Sheila Rima C. Magno

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