Shengyan Shang

Modelling the melting of Sn0.7Cu solder using the enthalpy method

The temperature and velocity distribution during the transient melting phase change in Sn-0.7Cu solder alloy has been modelled using finite element method. The simulation of melting front dynamics has been performed by an Eulerian method, commonly known as enthalpy method. CALPHAD technique is utilized for the computation of enthalpy of the solder material. The flow in the liquid regime of the solder is assumed incompressible and natural convection effects are incorporated through the Boussinesq approximation. The asymptotic viscosity is employed for the mushy zone. For a horizontal finite temperature gradient imposed on the square domain, the mushy zone is thinner at the upper half whereas thicker at the lower of the initially liquid region. Consequently, the melting front within the temperature range 500 K - 503 K moves faster towards the solid in the upper portion of the geometry. The velocity at the peripherial zones of the liquid undergoing convection flow reaches its maximum magnitude of 13 mm/s.

Quantitative polynomial free energy based phase field model for void motion and evolution in Sn under thermal gradient

As the electronic packaging and fabrication industries for solar PV cells assembly or panels are making endeavours in using Pb-free solder joints, the reliability of these joints can be taken as an important research topic. Among several aspects, the control of void formation, growth and evolution in lead-free Sn-based solders can be achieved if the underlying mechanism for such phenomena can be modeled. This study employs a quantitative polynomial free energy based phase field method to model the motion and evolution of void in Sn material under thermal gradient. The effects of imposed temperature gradient to the overall migration rate and profile of the void has been assessed in the finite element model.

Effect of the \(\text {TiO}_2\) Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints

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Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

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Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

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Study on Electrochemical Migration of Sn-0.7Cu

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