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Featured researches published by Shigeru Asami.


Japanese Journal of Applied Physics | 1983

Reversible Read-Write-Erase Properties of Styrene Oligomer Optical Recording Media

Akihiko Kuroiwa; Kenryo Namba; Shigeru Asami; Toshiki Aoi; Kazuo Takahashi; Shiro Nakagawa

Optical recording media consisting of a thermoplastic oligomer resin blended with a photoabsorbing pigment permit heat-mode pit writing without corona discharge, as well as heat erasure and rewriting. The properties of recording layers consisting of styrene oligomers having number-average molecular weights (Mn) of 400 or 3000 blended with copper phthalocyanine or anthraquinone pigment, when subjected to recording and playback operations with a helium-neon (He–Ne) laser, are investigated. In addition, full-surface heat erasure, and scanning heat erasure are discussed. Pits with an outside diameter of 2.5 µm were recorded (writing time, 2 µsec) with a 10 mW He–Ne laser light. A readout signal contrast (ratio of reflected light intensity in the absence of pits to that in the presence of pits) of 3 was obtained.


Archive | 2004

Electronic component module

Eriko Ajioka; Shigeru Asami; Hideaki Shimoda; Hiroshi Ikeda; Yoshinari Yamashita; Hitoyoshi Kurata


Archive | 1985

Optical recording medium having a liquid crystal layer

Akihiko Kuroiwa; Shigeru Asami; Toshiki Aoi; Kazuo Takahashi; Kenryo Namba


Archive | 2004

Electronic component module and manufacturing method thereof

Eriko Ajioka; Hitoyoshi Kurata; Hideaki Shimoda; Shigeru Asami


Archive | 2009

Electronic module and fabrication method thereof

Shigeru Asami


Archive | 2001

Polymer insulation material and its manufacturing method, and electronics-related substrate and electronic member

Naoyuki Amaya; Shigeru Asami; Hiroaki Hasegawa; Yukihiro Kato; Shiro Mio; Masami Okuo; Toshiaki Takaoka; Mieko Tamura; Toshiaki Yamada; 行浩 加藤; 直之 天谷; 雅巳 奥尾; 史朗 実生; 俊昭 山田; 茂 浅見; 美枝子 田村; 浩昭 長谷川; 利明 高岡


Archive | 1998

Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same

Toshiaki Yamada; Takeshi Takahashi; Yoshiyuki Yasukawa; Kenji Endou; Shigeru Asami; Michihisa Yamada; Yasuo Moriya


Archive | 1998

HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM

Toshiaki Yamada; Takeshi Takahashi; Yoshiyuki Yasukawa; Kenji Endou; Shigeru Asami; Michihisa Yamada; Yasuo Moriya


Archive | 2011

ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Shigeru Asami; Hiroki Hara; Shinsei Kameda; Kenichi Kawabata; Morikazu Tajima; Shuichi Takizawa; 真清 亀田; 浩樹 原; 賢一 川畑; 茂 浅見; 修一 滝澤; 盛一 田島


Archive | 2011

ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT MODULE COMPONENT

Shigeru Asami; Seiichi Tajima; Hiroki Hara; Shuichi Takizawa; Masumi Kameda; Kenichi Kawabata

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