Shih-Hao Chan

Low-temperature synthesis of graphene on Cu using plasma-assisted thermal chemical vapor deposition

Plasma-assisted thermal chemical vapor deposition (CVD) was carried out to synthesize high-quality graphene film at a low temperature of 600°C. Monolayer graphene films were thus synthesized on Cu foil using various ratios of hydrogen and methane in a gaseous mixture. The in situ plasma emission spectrum was measured to elucidate the mechanism of graphene growth in a plasma-assisted thermal CVD system. According to this process, a distance must be maintained between the plasma initial stage and the deposition stage to allow the plasma to diffuse to the substrate. Raman spectra revealed that a higher hydrogen concentration promoted the synthesis of a high-quality graphene film. The results demonstrate that plasma-assisted thermal CVD is a low-cost and effective way to synthesis high-quality graphene films at low temperature for graphene-based applications.

The effect of annealing on nanothick indium tin oxide transparent conductive films for touch sensors

This study aims to discuss the sheet resistance of ultrathin indium tin oxide (ITO) transparent conductive films during the postannealing treatment. The thickness of the ultrathin ITO films is 20 nm. They are prepared on B270 glass substrates at room temperature by a direct-current pulsed magnetron sputtering system. Ultrathin ITO films with high sheet resistance are commonly used for touch panel applications. As the annealing temperature is increased, the structure of the ultrathin ITO film changes from amorphous to polycrystalline. The crystalline of ultrathin ITO films becomes stronger with an increase of annealing temperature, which further leads to the effect of enhanced Hall mobility. A postannealing treatment in an atmosphere can enhance the optical transmittance owing to the filling of oxygen vacancies, but the sheet resistance rises sharply. However, a higher annealing temperature, above 250°C, results in a decrease in the sheet resistance of ultrathin ITO films, because more Sn ions become an effective dopant. An optimum sheet resistance of 336Ω/sqr was obtained for ultrathin ITO films at 400°C with an average optical transmittance of 86.8% for touch sensor applications.

FTO films deposited in transition and oxide modes by magnetron sputtering using tin metal target.

Fluorine-doped tin oxide (FTO) films were prepared by pulsed DC magnetron sputtering with a metal Sn target. Two different modes were applied to deposit the FTO films, and their respective optical and electrical properties were evaluated. In the transition mode, the minimum resistivity of the FTO film was 1.63×10(-3)  Ω cm with average transmittance of 80.0% in the visible region. Furthermore, FTO films deposited in the oxide mode and mixed simultaneously with H2 could achieve even lower resistivity to 8.42×10(-4)  Ω cm and higher average transmittance up to 81.1% in the visible region.

Spectral monitoring CH/C 2 ratio of methane plasma for growing single-layer graphene on Cu

Single-layer graphene was grown on copper at a low temperature of 600°C by plasma-assisted thermal chemical vapor deposition. Its growth mechanism was discussed with reference to the emission spectra of the plasma. The methane plasma produces the active species (Hx, CHx, and Cx) without the addition of flowing hydrogen, and the amounts of hydrogen-containing species can be controlled by varying the plasma power. The effective distance was found between the plasma initial stage and the deposition stage for the single-layer graphene synthesis. The results reveal that high-quality graphene can be synthesized using methane plasma at a suitable plasma power.

Manipulation of MoSe2 Films on CuIn(Ga)Se2 Solar Cells during Rapid Thermal Process

In this study, the CuIn(Ga)Se2 (CIGS) crystalline quality and MoSe2 thickness of films produced by the rapid thermal selenization process under various selenization pressures were investigated. When the selenization pressure increased from 48 Pa to 1.45 × 104 Pa, the CIGS films were smooth and uniform with large crystals of varying sizes. However, the MoSe2 thicknesses increased from 50 nm to 2,109 nm, which created increased contact resistivity for the CIGS/MoSe2/Mo structures. The efficiency of CIGS solar cells could be increased from 1.43% to 4.62% due to improvement in the CIGS crystalline quality with increasing selenization pressure from 48 Pa to 1.02 × 103 Pa. In addition, the CIGS crystalline quality and MoSe2 thickness were modified by the pressure released valve (PRV) selenization process method. The crystalline qualities of the CIGS films were similarly affected by the selenization pressure at 1.02 × 103 Pa in the PRV selenization method and the MoSe2 thicknesses were reduced from 1,219 nm to 703 nm. A higher efficiency of 5.2% was achieved with the thinner MoSe2 obtained by using the PRV selenization method.

Controllable photonic mirror fabricated by the atomic layer deposition on the nanosphere template

In this study, a controllable photonic mirror was fabricated using the atomic layer deposition (ALD) coating technique on a polystyrene (PS) nanosphere template. PS nanospheres were self-assembled on an Al/glass substrate to form the bottom electrode. A 20 nm ALD Al2O3 film was then coated onto the surface of the reduced PS nanosphere structure. The PS nanospheres were removed in air at 350°C to form hollow Al2O3 nanospheres. Then a 30 nm indium tin oxide film was sputtered on the hollow nanosphere structure to form the top electrode. The results show that the incorporation of the photonic mirror could control the reflectance to a value of 0.3% per 0.1 V of bias voltage.

Atomic layer deposition of aluminum-doped zinc oxide films for the light harvesting enhancement of a nanostructured silicon solar cell

Anodic-aluminum-oxide (AAO) template lithography and atomic layer deposition (ALD) antireflection coating techniques have often been applied for the fabrication of wide-angle antireflection structures on silicon solar cells. In this study, an AAO template was fabricated as a mask to block the high density plasma dry etching from the crystalline silicon to form nanostructures on the surface of the crystalline silicon wafer. Then, a 55-nm-thick aluminum-doped zinc oxide (AZO) film was deposited on the silicon nanostructures using the ALD method. The results show that the application of a nanostructured AZO film can decrease the average reflectivity of the crystalline silicon to 0.83% in the wavelength range from 400 to 850 nm for an incident angle of 8°. The conversion efficiency of the nanostructured silicon solar cell can be enhanced from 6.93% to 8.37%.

The deviation of growth model for transparent conductive graphene.

An approximate growth model was employed to predict the time required to grow a graphene film by chemical vapor deposition (CVD). Monolayer graphene films were synthesized on Cu foil at various hydrogen flow rates from 10 to 50 sccm. The sheet resistance of the graphene film was 310Ω/□ and the optical transmittance was 97.7%. The Raman intensity ratio of the G-peak to the 2D peak of the graphene film was as high as ~4 when the hydrogen flow rate was 30 sccm. The fitting curve obtained by the deviation equation of growth model closely matches the data. We believe that under the same conditions and with the same setup, the presented growth model can help manufacturers and academics to predict graphene growth time more accurately.

FTO films deposited in transition and oxide modes by magnetron sputtering using Sn metal target

FTO films were prepared by a pulse DC magnetron sputtering with a metal Sn target. FTO films could achieve the resistivity lower than 8.42×10-4 Ω-cm and the average transmittance up to 81.08 % in visible region.

Three-Dimensional Plasmon Resonance Device Fabricated by Auto-Cloning Deposition and Atomic Layer Deposition

3D plasmon resonance device has been fabricated by using autocloning technique and atomic-layer-deposition methods. The device is based on a metal-insulator-metal rectenna circuit. The power conversion efficiencies of the device were 1.3×10-3.