Shih-Kang Tien
National Tsing Hua University
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Publication
Featured researches published by Shih-Kang Tien.
Surface & Coatings Technology | 2004
Wei-Yu Chen; Shih-Kang Tien; Fan-Bean Wu; Jenq-Gong Duh
Abstract The Ni–P-based coatings, including binary Ni–P, ternary Ni–P–Cr and Ni–P–W, were fabricated by the RF magnetron sputtering technique with dual target of electroless Ni–P alloy and a third metal element. To evaluate the influence of the doping element in Ni–P deposit, differential scanning calorimeter (DSC) analysis was employed to characterize the temperature of phase transformation. The phase transition during thermal evolution under heat-treatment was analyzed by X-ray diffractometry (XRD). Crystallization behavior in binary and ternary Ni–P-based coatings was quite distinct due to the addition of Cr and W. Microhardness tests indicated that the sputtered Ni–P–Cr and Ni–P–W coatings exhibited superior hardness and excellent thermal stability than the Ni–P coating. In addition, chromium exhibited compatible thermal characteristics with the tungsten for the ternary Ni–P-based system. The strengthening mechanism in the sputtered Ni–P–Cr and Ni–P–W deposits is also discussed.
Thin Solid Films | 2006
Jyh-Wei Lee; Shih-Kang Tien; Yu-Chu Kuo
Scripta Materialia | 2007
Yung-Chi Lin; Toung-Yi Shih; Shih-Kang Tien; Jenq-Gong Duh
Surface & Coatings Technology | 2006
Jyh-Wei Lee; Shih-Kang Tien; Yu-Chu Kuo; Chih-Ming Chen
Surface & Coatings Technology | 2004
Shih-Kang Tien; Jenq-Gong Duh; Yung-I Chen
Thin Solid Films | 2006
Shih-Kang Tien; Jenq-Gong Duh
Surface & Coatings Technology | 2007
Shih-Kang Tien; Jenq-Gong Duh; Jyh-Wei Lee
Surface & Coatings Technology | 2004
Fan-Bean Wu; Shih-Kang Tien; Wei-Yu Chen; Jenq-Gong Duh
Surface & Coatings Technology | 2007
Shih-Kang Tien; Chih-Hsiung Lin; Yan-Zuo Tsai; Jenq-Gong Duh
Thin Solid Films | 2004
Shih-Kang Tien; Jenq-Gong Duh; Yung I. Chen