Shin Matsuda

Development of a micro catalytic combustor using high-precision ceramic tape casting

A micro-scale catalytic combustor fueled by butane was investigated. High-precision ceramic tape-casting technology was adopted for developing a three-dimensional structure of the combustor with embedded heat exchange channels. Nano-porous alumina fabricated through anodic oxidation of aluminum layers was employed for the support of Pd catalyst. Combustion experiments were carried out in a solder bath to keep the catalyst temperature constant. Complete fuel conversion for a n-butane flow rate of 5.0 sccm has been achieved at 390 °C corresponding to 100 MW m−3 heat generation. Reaction constants for catalytic combustion on the Pd/nano-porous alumina were determined with the aid of a 1D plug flow model. Those parameters were successfully combined with a CFD analysis to investigate the detailed transport phenomena and to predict the performance of the combustor at higher temperature. It was also shown in a preliminary experiment in air that the reaction can be self-sustained at 425 °C with the n-butane flow rate of 15 sccm.

Snap array CSP/sup TM/. Ceramic CSPs for high performance and high reliability applications

Chip Scale Package (CSP) adaptation has been drastically increasing as the key component to facilitate miniaturization for portable electronic devices such as Cellular phone, Camcorder, PDA, etc. which are mainly consumer electronics devices. In addition, high I/O count CSP are predicted to support high performance IC devices for Workstation and Mainframe, and high reliability CSP is also demanded for broadening the application for high-end market such as satellite communication application. Ceramic has been a leading material for the rigid interposer style of CSP. Ceramic technology has many advantages such as design flexibility with fine design rule, buried and blind via holes, high thermal conductivity, and stability of material properties at high temperature and harsh environment. Ceramic technology is considered to be the most suitable for CSP application where high performance and high reliability are required. Kyocera has been developing Snap Array CSP/sup TM/ technologies utilizing ceramic technology and optimized assembly materials. Productivity at assembly process has been drastically improved by using an array format carrier. Specification of an array format carrier is optimized for utilizing current assembly equipment designed for PBGA and PQFP. Through continued development and optimization, a wide variety of Snap Array CSP/sup TM/ have been realized.

Packaging technology of OptoBGA for 2.4 Gb/s

The significantly increasing transmission capacity in the subscriber system are accelerating demands for higher data transmission speed, low cost, and system miniaturization in the millennium approaches. The key solution for the demands, smaller, lower cost, and high performance package, is surface technology. OptoBGA package has been developed to meet this challenge, a surface mountable type optical package that is designed for high frequency transmission speeds. OptoBGA package has a BGA structure to bring forth effectively size and cost reduction for the packaging. OptoBGA consists of ceramic material, a robust material, which has many advantages such as design flexibility with fine design rule, ease of process technology, high performance, and high reliability. The design of OptoBGA was made possible by improvement in the physical structure. The results of this research produced an OptoBGA with a return loss of about -20dB at 10GHz. Furthermore, reliability test evaluations have been conducted to demonstrate that the OptoBGA can withstand harsh environments.