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Featured researches published by Shinji Hashimoto.


Archive | 1988

Sealing of semiconductor device

Taro Fukui; Shinji Hashimoto; Masaya Tsujimoto


Archive | 2000

Composition of cyanate ester, epoxy resin and acid anhydride

Hirohisa Hino; Taro Fukui; Kenji Kitamura; Shinji Hashimoto; Naoki Kanagawa


Archive | 2000

Liquid epoxy resin composition for sealing semiconductor, semiconductor device and method for manufacturing the device

Taro Fukui; Shinji Hashimoto; Hirohisa Hino; Naoki Kanekawa; Kenji Kitamura; 賢次 北村; 裕久 日野; 眞治 橋本; 太郎 福井; 直樹 金川


Archive | 1989

Production of epoxy resin sealant

Taro Fukui; Shinji Hashimoto; Hiroshi Yamamoto


Archive | 1995

EPOXY RESIN COMPOSITION, ITS PRODUCTION AND SEMICONDUCTOR DEVICE USING THE SAME

Shinji Hashimoto; Yasuhisa Kishigami; Kyoko Shimada; 泰久 岸上; 恭子 嶋田; 眞治 橋本


Archive | 1986

One pack epoxy resin composition

Taro Fukui; Shinji Hashimoto; Hirohisa Hino; Masaya Tsujimoto


Archive | 1990

Epoxy resin material for sealing photosemiconductor

Taro Fukui; Shinji Hashimoto; Yasuhisa Kishigami; Kenji Kitamura; Masaya Tsujimoto; Hiroshi Yamamoto


Archive | 1994

Epoxy resin composition, its production and semiconductor apparatus obtained by using the composition

Shinji Hashimoto; Yasuhisa Kishigami; Kazuhiko Watanabe; 泰久 岸上; 眞治 橋本; 和彦 渡辺


Archive | 1990

Epoxy resin sealing material for photosemiconductor

Taro Fukui; Shinji Hashimoto; Yasuhisa Kishigami; Kenji Kitamura; Hiroshi Yamamoto


Archive | 2000

RESIN-SEALING METHOD OF FLIP-CHIP PACKAGE, PRINT MASK FOR RESIN SEALING USED THEREFOR, AND SEMICONDUCTOR DEVICE

Taro Fukui; Shinji Hashimoto; Hirohisa Hino; Naoki Kanekawa; Kenji Kitamura; 賢次 北村; 裕久 日野; 眞治 橋本; 太郎 福井; 直樹 金川

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