Shinji Hoshino

Adhesive tape for resin-encapsulating and method of manufacture of resin-encapsulated semiconductor device

Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet

Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet

Heat resistant adhesive sheet used in the fabrication of substrateless semiconductor package

OPTICAL DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, TOUCH PANEL, IMAGE DISPLAY DEVICE, AND SEPARATING METHOD

Heat-resistant adhesive sheet for semiconductor device fabrication and adhesive used for the sheet

PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER

Optical double-sided pressure-sensitive adhesive sheet and separating method for separating members laminated with the sheet

Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape