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Shozo Nakamura

Hiroshima Institute of Technology

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Publication

Featured researches published by Shozo Nakamura.

Journal of Japan Institute of Electronics Packaging | 2003

Optimum Layer Construction with Thermo-Viscoelastic Analysis Influences Thermal Residual Stress and Warp Deformation in Electronic Devices

Shozo Nakamura; Yoshiyuki Kushizaki; Masahiko Goto; Kazuhiko Ohashi; Mitsuo Kido

Journal of Japan Institute of Electronics Packaging | 2002

Termo-Viscoelastic Numerical Analysis of Residual Stress Influenced by Material Properties in Semiconductor Devices

Shozo Nakamura; Yoshiyuki Kushizaki; Gen Murakami; Mitsuo Kido

journal of the Japan Society for Testing Materials | 2008

Expedient Evaluation Method of Warp Deformation Behavior for Viscoelastic Laminated Beam Consisted of Epoxy Resin and Steel

Shozo Nakamura; Takuya Kawabata; Yu Fukui; Kenji Yoshimi

Journal of Japan Institute of Electronics Packaging | 2002

Thermo-Viscoelastic Analysis of Thermal Residual Stress and Deformation Influenced by Loaded Temperature for Constitutive Materials in Electronic Devices

Shozo Nakamura; Masahiko Goto; Yoshiyuki Kushizaki; Mitsuo Kido

Seikei-kakou | 2003

Thermo-viscoelastic Analysis of Thermal Residual Stress and Warp Deformation Influenced by Material Properties in Plastic Laminated Beams

Shozo Nakamura; Masahiko Goto; Yoshiyuki Kushizaki

Journal of Japan Institute of Electronics Packaging | 2008

Theoretical and Experimental Examination of Warp Deformation Behavior of Viscoelastic Two-Layer-Laminated Body Caused by Thermal Load

Shozo Nakamura; Yu Fukui; Hironori Isobe; Takao Iwamoto

Seikei-kakou | 2005

Thermal Aging Behavior of Epoxy Resin Used in Ultra-thin Semiconductor Devices

Shozo Nakamura; Yusuke Sembo

The Proceedings of Conference of Chugoku-Shikoku Branch | 2004

Thermal Viscoelasticity and Curing Behavior Influenced by Thermal Load for Epoxy Resin

Ryuichi Unoki; Shozo Nakamura

Journal of Japan Institute of Electronics Packaging | 2004

Optimum Design of Layer Construction and Properties with Thermo-Viscoelastic Stress Analysis in New BOC Package

Shozo Nakamura; Masahiko Goto; Yusuke Sembou; Kazuhiko Ohashi

The Proceedings of Conference of Chugoku-Shikoku Branch | 2003

Thermo-Viscoelastic Properties of Adhesives used for Electronic Devices in Curing Processes

Yusuke Sakata; Ryuichi Unoki; Shozo Nakamura

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Collaboration

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Masahiko Goto

Hiroshima Institute of Technology

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Yoshiyuki Kushizaki

Hiroshima Institute of Technology

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Mitsuo Kido

Hiroshima Institute of Technology

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Yu Fukui

Hiroshima Institute of Technology

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Hironori Isobe

Hiroshima Institute of Technology

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Takao Iwamoto

Hiroshima Institute of Technology

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Yusuke Sakata

Hiroshima Institute of Technology

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Yusuke Sembo

Hiroshima Institute of Technology

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Yusuke Sembou

Hiroshima Institute of Technology

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Gen Murakami

Hitachi

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