Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Shozui Takeno is active.

Publication


Featured researches published by Shozui Takeno.


Journal of Laser Micro Nanoengineering | 2009

Laser Drilling of Epoxy-Glass Printed Circuit Boards

Shozui Takeno; Masaharu Moriyasu; Masaki Kuzumoto; Miki Kurosawa; Yoshinori Hirata

Nagoya Works,Mitsubishi Electric Corporation, 1-14, Yada-minami 5-chome, Higashi-ku, Nagoya, Aichi 461-8670, Japan E-mail: [email protected] Manufacturing Engineering Center, Advanced Technology R&D Center, Mitsubishi Electric Corporation, 1-1, Tsukaguchi-honmachi 8-chome, Amagasaki, Hyogo 661-8661, Japan **** Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan


International Congress on Applications of Lasers & Electro-Optics | 1992

Laser drilling by high peak pulsed CO2 laser (LDHPCL)

Shozui Takeno; Masaharu Moriyasu; Seigo Hiramoto

Control of input heat to reduce the incidence of recast layers and cracks formed during laser processing of non-metallic materials was studied.Suitable ranges of pulse parameters including peak power, pulse duration, and frequency for non-metallic materials were determined using theoretical investigations. Based on the results of this experiment, a high peak pulsed CO2 laser which output pulses of tens of microseconds using the TEMoo beam mode and 5kW of peak power, was developed. This high peak pulsed CO2 laser was used to study the fundamentals of laser drilling of ceramics and printed wiring boards (PWBs).In the case of ceramics, recast layers including microcracks on the side walls of drilled holes were caused by conventional CO2 lasers. Use of the high peak pulsed CO2 laser reduced the size of recast layers. Furthermore, the effect of the beam-plasma interaction on the hole shape was examined. The results revealed that in air, plasma plume induced beam scattering increased hole diameter. It was also found that decreasing the pulse duration could limit the effects of beam scattering.Conventional laser drilling of PWBs results in glass fiber protrusions. The high peak pulsed CO2 laser was found to decrease the amount of glass fiber protrusions. It was discovered that lowering the pulse frequency successfully reduced heat accumulation; a major cause of glass fiber protrusions. It was possible to fabricate high aspect ratio (=10) holes in epoxy-glass PWBs without glass fiber protrusions using the high peak pulsed CO2 laser set a short pulse durations and low frequencies.Control of input heat to reduce the incidence of recast layers and cracks formed during laser processing of non-metallic materials was studied.Suitable ranges of pulse parameters including peak power, pulse duration, and frequency for non-metallic materials were determined using theoretical investigations. Based on the results of this experiment, a high peak pulsed CO2 laser which output pulses of tens of microseconds using the TEMoo beam mode and 5kW of peak power, was developed. This high peak pulsed CO2 laser was used to study the fundamentals of laser drilling of ceramics and printed wiring boards (PWBs).In the case of ceramics, recast layers including microcracks on the side walls of drilled holes were caused by conventional CO2 lasers. Use of the high peak pulsed CO2 laser reduced the size of recast layers. Furthermore, the effect of the beam-plasma interaction on the hole shape was examined. The results revealed that in air, plasma plume induced beam scattering increased hole diameter. It was also ...


Archive | 2009

Laser machining device

Masahiko Sakamoto; Shozui Takeno; Yasuhiko Iwai; Toshiyuki Hokodate; Miki Kurosawa


Archive | 1998

Method of dicing semiconductor wafer

Masahiro Tamaki; Kazuo Hayashi; Shozui Takeno


Archive | 2001

Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board

Miki Kurosawa; Tsukasa Fukushima; Masanori Mizuno; Shozui Takeno; Masaharu Moriyasu; Masayuki Kaneko


Archive | 1998

Apparatus for inspecting a printed circuit board

Satoshi Nishida; Masanori Mizuno; Miki Kurosawa; Shozui Takeno; Masaharu Moriyasu


Archive | 1995

Laser cutting method eliminating defects in regions where cutting conditions are changed

Masaru Kanaoka; Homare Mori; Takayuki Yuyama; Shozui Takeno


Archive | 2002

Method and device for laser beam machining of laminated material

Nobutaka Kobayashi; Shozui Takeno; Kenji Ito; Masaharu Moriyasu


Archive | 2005

Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations

Miki Kurosawa; Tsukasa Fukushima; Masanori Mizuno; Shozui Takeno; Masaharu Moriyasu; Masayuki Kaneko


Archive | 1991

Method for working ceramic material

Shozui Takeno; Mari Yoshimura; Kohei Murakami; Masaharu Moriyasu

Collaboration


Dive into the Shozui Takeno's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Researchain Logo
Decentralizing Knowledge