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Dive into the research topics where Shuguo Jia is active.

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Featured researches published by Shuguo Jia.


Metals and Materials International | 2005

Electrotribological behavior of Cu−Ag−Zr contact wire against copper-base strip

Shuguo Jia; Ping Liu; Fengzhang Ren; Baohong Tian; M. Zheng; G.S. Zhou

Cu−Ag−Zr alloy has an excellent combination of mechanical strength and electrical conductivity, and is a promising contact wire material for high-speed electrified railways. An investigation of the electritrobological behavior of Cu−Ag−Zr wire is presented here. Wear tests are conducted under laboratory conditions with a specified sliding wear tester that simulated train motion under an electrical current applied across the sliding interface. The Cu−Ag−Zr alloy wire is slid against a copper-based powder metallurgy strip used in railway systems under unlubricated conditions. Worn surfaces of the Cu−Ag−Zr alloy wire are analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectrum (EDS). Within the studied range of electrical current, normal pressure, and sliding speed, the wear rate increases with increasing electrical current and sliding distance. Adhesive wear, abrasive wear, and electrical erosion are the dominant mechanisms during the electrical sliding processes. Compared with a Cu−Ag contact wire under the same test conditions, the Cu−Ag−Zr alloy wire has much better wear resistance.


Metals and Materials International | 2007

Electrotribological property of the Cu−Ag−Cr alloy with high-strength and high-conductivity

Shuguo Jia; Ping Liu; Fengzhang Ren; Baohong Tian; M. Zheng; G.S. Zhou

By means of a vacuum induction furnace, a Cu−Ag−Cr alloy was produced. The electrotribological property and mechanism of the Cu−Ag−Cr alloy wear studied via wear property tests, scanning electron microscope (SEM), energy dispersive X-ray spectrum (EDS) and transmission electron microscopy (TEM). Wear tests were conducted with a specially designed sliding wear tester, which simulated the tribological conditions of sliding current collectors on contact wires in a railway system. The alloy wire was slid against a copperbased powder metallurgy strip under non-lubricated conditions. The results showed that the wear rate of Cu−Ag−Cr alloy increases as the sliding speed increases under a normal load. Adhesive wear, abrasive wear, and electrical erosion wear are the governing wear mechanisms under the electrical current sliding processes. Under the same conditions, the wear resistance of the Cu−Ag−Cr alloy is 2–3 times that of the Cu−Ag alloy.


Wear | 2007

Sliding wear behavior of copper alloy contact wire against copper-based strip for high-speed electrified railways

Shuguo Jia; Ping Liu; Fengzhang Ren; Baohong Tian; M. Zheng; G.S. Zhou


Archive | 2008

Preparing method of contact tip composite material of vacuum switch based on dispersed copper

Baohong Tian; Ping Liu; Yong Liu; Chengdong Xia; Kexing Song; Fengzhang Ren; Shuguo Jia; Hongxia Li; Jianjuan Zhu


Archive | 2009

Rare earth-containing copper base alloy material and preparation method thereof

Shuguo Jia; Ping Liu; Kexing Song; Dongmei Zhao; Baohong Tian; Peifeng Zhao; Juanhua Su; Yong Liu; Yi Zhang; Wei Ren


Metals and Materials International | 2009

Age hardening characteristics of Cu-Ag-Zr alloy

Shuguo Jia; X. M. Ning; Ping Liu; M. Zheng; G.S. Zhou


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2006

Adhesion strength of Ni film on Ti substrate characterized by three-point bend test, peel test and theoretic calculation

Fengzhang Ren; Ping Liu; Shuguo Jia; Baohong Tian; Juan-hua Su


Archive | 2009

High performance copper-based alloy material and preparation thereof

Shuguo Jia; Ping Liu; Dongmei Zhao; Kexing Song; Baohong Tian; Shaohua Chen; Fengzhang Ren; Huafen Lou; Yong Liu; Wei Ren; Jingle Kang


Archive | 2009

Preparation process of rare-earth copper alloy material for preparing integral dispersion copper

Baohong Tian; Ping Liu; Yong Liu; Kexing Song; Shuguo Jia; Fengzhang Ren; Hongxia Li; Yi Zhang; Xiaohong Chen


Archive | 2008

Copper alloy material for lead frames, and preparation method thereof

Ping Liu; Shuguo Jia; Yi Zhang; Dongmei Zhao; Baohong Tian; Honglei Li; Shaohua Chen; Kexing Song; Fengzhang Ren; Huafen Lou; Juanhua Su

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Baohong Tian

Henan University of Science and Technology

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Fengzhang Ren

Henan University of Science and Technology

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Ping Liu

Henan University of Science and Technology

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Yong Liu

Henan University of Science and Technology

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Kexing Song

Henan University of Science and Technology

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Yi Zhang

Henan University of Science and Technology

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Dongmei Zhao

Xi'an Jiaotong University

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G.S. Zhou

Xi'an Jiaotong University

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M. Zheng

Xi'an Jiaotong University

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Shiyang Zhao

Henan University of Science and Technology

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