Shui-Qing Yu

Extended performance GeSn/Si(100) p-i-n photodetectors for full spectral range telecommunication applications

First-generation n-i-GeSn/p-Si(100) photodiode detectors with Ge0.98Sn0.02 active layers were fabricated under complementary metal oxide semiconductor compatible conditions. It is found that, even at this low Sn concentration, the detector quantum efficiencies are higher than those in comparable pure-Ge device designs processed at low temperature. Most significantly, the spectral range of the GeSn device responsivity is dramatically increased—to at least 1750 nm—well beyond the direct band gap of Ge (1550 nm). This allows coverage of all telecommunication bands using entirely group IV materials.

Direct-bandgap GeSn grown on silicon with 2230 nm photoluminescence

Material and optical characterizations have been conducted for epitaxially grown Ge1−xSnx thin films on Si with Sn composition up to 10%. A direct bandgap Ge0.9Sn0.1 alloy has been identified by temperature-dependent photoluminescence (PL) study based on the single peak spectrum and the narrow line-width. Room temperature PL emission as long as 2230 nm has also been observed from the same sample.

An optically pumped 2.5 μm GeSn laser on Si operating at 110 K

This paper reports the demonstration of optically pumped GeSn edge-emitting lasers grown on Si substrates. The whole device structures were grown by an industry standard chemical vapor deposition reactor using the low cost commercially available precursors SnCl4 and GeH4 in a single run epitaxy process. Temperature-dependent characteristics of laser-output versus pumping-laser-input showed lasing operation up to 110 K. The 10 K lasing threshold and wavelength were measured as 68 kW/cm2 and 2476 nm, respectively. Lasing characteristic temperature (T0) was extracted as 65 K.

Room-temperature electroluminescence from Ge/Ge1-xSnx/Ge diodes on Si substrates

Double heterostructure Ge/Ge1-xSnx/Ge light-emitting diodes (LEDs) with 6% and 8% Sn were grown on Si substrates using chemical vapor deposition. The electroluminescence emission spectra from the fabricated LEDs were investigated at room-temperature under different injection levels. The observed emission peaks at 0.645 eV and 0.601 eV are attributed to the direct bandgap transition of the Ge0.94Sn0.06 and Ge0.92Sn0.08 layers, respectively. Moreover, the integrated emission intensity increases as the Sn composition increases under the same injection condition.

Temperature dependent spectral response and detectivity of GeSn photoconductors on silicon for short wave infrared detection.

The GeSn direct gap material system, with Si complementary-metal-oxide semiconductor (CMOS) compatibility, presents a promising solution for direct incorporation of focal plane arrays with short wave infrared detection on Si. A temperature dependence study of GeSn photoconductors with 0.9, 3.2, and 7.0% Sn was conducted using both electrical and optical characterizations from 300 to 77 K. The GeSn layers were grown on Si substrates using a commercially available chemical vapor deposition reactor in a Si CMOS compatible process. Carrier activation energies due to ionization and trap states are extracted from the temperature dependent dark I-V characteristics. The temperature dependent spectral response of each photoconductor was measured, and a maximum long wavelength response to 2.1 μm was observed for the 7.0% Sn sample. The DC responsivity measured at 1.55 μm showed around two orders of magnitude improvement at reduced temperatures for all samples compared to room temperature measurements. The noise current and temperature dependent specific detectivity (D*) were also measured for each sample at 1.55 μm, and a maximum D* value of 1 × 10(9) cm·√Hz/W was observed at 77 K.

Competition of optical transitions between direct and indirect bandgaps in Ge1−xSnx

Temperature-dependent photoluminescence (PL) study has been conducted in Ge1−xSnx films with Sn compositions of 0.9%, 3.2%, and 6.0% grown on Si. The competing between the direct and indirect bandgap transitions was clearly observed. The relative peak intensity of direct transition with respect to the indirect transition increases with an increase in temperature, indicating the direct transition dominates the PL at high temperature. Furthermore, as Sn composition increases, a progressive enhancement of direct transition was observed due to the reduction of direct-indirect valley separation, which experimentally confirms that the Ge1−xSnx could become the group IV-based direct bandgap material grown on Si by increasing the Sn content.

A semi-analytical model for semiconductor solar cells

A semi-analytical model is constructed for single- and multi-junction solar cells. This model incorporates the key performance aspects of practical devices, including nonradiative recombination, photon recycling within a given junction, spontaneous emission coupling between junctions, and non-step-like absorptance and emittance with below-bandgap tail absorption. Four typical planar structures with the combinations of a smooth/textured top surface and an absorbing/reflecting substrate (or backside surface) are investigated, through which the extracted power and four types of fundamental loss mechanisms, transmission, thermalization, spatial-relaxation, and recombination loss are analyzed for both single- and multi-junction solar cells. The below-bandgap tail absorption increases the short-circuit current but decreases the output and open-circuit voltage. Using a straightforward formulism this model provides the initial design parameters and the achievable efficiencies for both single- and multiple-junctio...

Molecular beam epitaxial growth of Bi2Te3 and Sb2Te3 topological insulators on GaAs (111) substrates: a potential route to fabricate topological insulator p-n junction

High quality Bi2Te3 and Sb2Te3 topological insulators films were epitaxially grown on GaAs (111) substrate using solid source molecular beam epitaxy. Their growth and behavior on both vicinal and non-vicinal GaAs (111) substrates were investigated by reflection high-energy electron diffraction, atomic force microscopy, X-ray diffraction, and high resolution transmission electron microscopy. It is found that non-vicinal GaAs (111) substrate is better than a vicinal substrate to provide high quality Bi2Te3 and Sb2Te3 films. Hall and magnetoresistance measurements indicate that p type Sb2Te3 and n type Bi2Te3 topological insulator films can be directly grown on a GaAs (111) substrate, which may pave a way to fabricate topological insulator p-n junction on the same substrate, compatible with the fabrication process of present semiconductor optoelectronic devices.

Si based GeSn photoconductors with a 1.63 A/W peak responsivity and a 2.4 μm long-wavelength cutoff

Thin-film Ge0.9Sn0.1 structures were grown by reduced-pressure chemical vapor deposition and were fabricated into photoconductors on Si substrates using a CMOS-compatible process. The temperature-dependent responsivity and specific detectivity (D*) were measured from 300 K down to 77 K. The peak responsivity of 1.63 A/W measured at 1.55 μm and 77 K indicates an enhanced responsivity due to photoconductive gain. The measured spectral response of these devices extends to 2.4 μm at 300 K, and to 2.2 μm at 77 K. From analysis of the carrier drift and photoconductive gain measurements, we have estimated the carrier lifetime of this Ge0.9Sn0.1 thin film. The longest measured effective carrier lifetime of 1.0 × 10−6 s was observed at 77 K.

Ge1−ySny photoconductor structures at 1.55μm: From advanced materials to prototype devices

Prototype detector structures were fabricated on Si substrates using Ge1−ySny as active material for the first time. This alloy system covers the entire near-IR telecommunication spectrum and grows at a low temperature of 350°C, compatible with complementary metal-oxide-semiconductor (CMOS) Si technology. Processing protocols were developed for photolithography-based patterning and subsequent etching, CMOS compatible metallization, and for the formation of low-resistivity Ohmic contacts. A first generation of devices based on as-grown Ge1−ySny layers was followed by a second generation incorporating ex situ rapid thermal annealing for defect reduction, as well as additional growth and processing improvements, leading to enhanced mobilities and simultaneous reduction in intrinsic carrier concentrations. While both device generations show a significant photoconductive response at 1.55μm, the thicker second-generation samples yield improved performance due to better confinement of deleterious defects near th...