Shuichi Kawai

Characterization of the morphological, physical, and mechanical properties of seven nonwood plant fiber bundles

The morphological, physical, and mechanical properties of the nonwood plant fiber bundles of ramie, pineapple, sansevieria, kenaf, abaca, sisal, and coconut fiber bundles were investigated. All fibers except those of coconut fiber had noncircular cross-sectional shapes. The crosssectional area of the fiber bundles was evaluated by an improved method using scanning electron microscope images. The coefficient factor defined as the ratio of the cross-sectional area determined by diameter measurement, to the cross-sectional area determined by image analysis was between 0.92 and 0.96 for all fibers. This indicated that the area determined by diameter measurement was available. The densities of the fiber bundles decreased with increasing diameters. The diameters of each fiber species had small variation of around 3.4%-9.8% within a specimen. The tensile strength and Young’s modulus of ramie, pineapple, and sansevieria fiber bundles showed excellent values in comparison with the other fibers. The tensile strength and Young’s modulus showed a decreasing trend with increasing diameter of fiber bundles.

Manufacture and properties of low-density binderless particleboard from kenaf core

Low-density binderless particleboards from kenaf core were successfully developed using steam injection pressing. The target board density ranged from 0.10 to 0.30 g/cm3, the steam pressure used was 1.0 MPa, and the steam treatment times were 7 and 10 min. The mechanical properties, dimensional stability, and thermal and sound insulation performances of the boards were investigated. The results showed that the low-density kenaf binderless particleboards had good mechanical properties and dimensional stability relative to their low board densities. The board of 0.20 g/cm3 density with a 10-min treatment time produced the following values: modulus of rupture 1.1 MPa, modulus of elasticity 0.3 GPa, internal bond strength 0.10 MPa, thickness swelling in 24 h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. In addition, the boards are free from formaldehyde emission. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products.

Upgrading of urea formaldehyde-bonded reed and wheat straw particleboards using silane coupling agents

Reed and wheat straw particleboards bonded with urea formaldehyde (UF) resin were manufactured from two different material configurations (i.e., fine and coarse particles). The board densities were in the range of 0.550–.90g/cm3. The effects of particle size and board density on the board properties were examined. The properties of particleboard produced from fine particles were better than those made from coarse particles. An increase in board density resulted in a corresponding improvement in the board properties. The properties of OF bonded reed and wheat straw particleboards were relatively lower than those of commercial particleboards. Three silane coupling agents were used to improve the bondability between the reed and wheat particles and OF resin. Results of this study indicate that all the board properties were improved by the addition of silane coupling agent. The degree of improvement achieved from each coupling agent was different; epoxide silane was found to be more effective for reed straw particleboard, and amino silane was better for wheat straw particleboard.

Manufacture and properties of binderless particleboard from bagasse I: effects of raw material type, storage methods, and manufacturing process

Binderless particleboards were manufactured from sugarcane (Saccharum officinarum L.) bagasse by steam-injection pressing and by using hot pressing as a reference method. The inner layer (core/pith) and the outer hard fibrous layer (face/rind) of bagasse were used as raw materials. The effects of bagasse type, manufacturing process, and storage method on the mechanical properties of binderless particleboards were investigated. The results showed that the bagasse pith particles provided better board properties than bagasse rind particles. It seemed that bagasse pith particles were more easily deformed than bagasse rind particles, enlarging the bonding contact area. The severe conditions of steam-injection pressing caused delamination on the bagasse pith binderless boards with densities of 0.6 g/cm3 or higher, and gave poor bonding quality. However, steam-pressed boards showed relatively higher board properties than hot-pressed boards. The storage method of sugarcane bagasse affected the chemical composition and the board properties. It was shown that the extent of self-bonding formation depends on the chemical and morphological properties of lignocellulosic materials, as well as on the manufacturing conditions.

Formation of the density profile and its effects on the properties of particleboard

Summary Two types of particleboards bonded with an isocyanate resin, one with uniform vertical density profile (homo-profile), and the other with conventional U-shaped profile, were fabricated to various density levels using lauan (Shorea spp.) particles. The fundamental relationships between the density profile and the board properties were determined, and the results are summarized as follows:1. In homo-profile boards, the moduli of rupture (MOR) and elasticity (MOE), internal bond (IB) strength, and screw withdrawal resistance (SWR), are highly correlated to the board mean density.2. The bottom limit of the board density is estimated to be ca. 0.25 g/cm3, based on the correlation regressions between mechanical properties and mean density.3. At equal mean density level, the MOR and MOE of the conventional particleboards are higher than the homo-profile boards, due to the higher density near the faces. However, the reverse is true for IB, owing to the presence of the low density core in the former.4. The net impact of peak density on MOR and MOE is greater at higher mean density level while raising the core density results in more pronounced improvement in IB at lower density.5. In addition to the compaction ratio, the dimensional stability of the board is also affected by the peak area and mat moisture content.

Thermal insulation properties of wood-based sandwich panel for use as structural insulated walls and floors

Thermal insulation and warmth-keeping properties of thick plywood-faced sandwich panels with low-density fiberboard (plywood-faced sandwich, PSW), which were developed as wood-based structural insulation materials for walls and floors, are comprehensively clarified. The properties focused on were thermal conductivity (λ), thermal resistance (R), and thermal diffusivity (D). The results for PSW panels were compared with those for commercial wood-based boards, solid wood, and commercial insulators. The λ values were measured for PSW panels and their core and face elements. As a result, the composite theory of λ was found to be appropriate for PSW composites, because the calculated/experimental λ ratios were approximately 90%. The λ values for PSW panels with densities of 340 kg/m3 (PSW350) and 410kg/m3 (PSW400) were 0.070 and 0.077W/mK, respectively. The R values for PSW350 and PSW400 were 1.4 and 1.2m2K/W, and the D values were 0.00050 and 0.00046m2/h, respectively. Consequently, the PSW provided thermal insulation properties superior to those of the boards and in terms of warmth-keeping properties were greatly advantageous over the insulators. These advantages were due to the moderate densities of PSW panels. The PSW panel with sufficient thickness showed remarkably improved thermal resistance compared with those of the boards.

Development of binderless particleboard from kenaf core using steam-injection pressing

Binderless particleboards were successfully developed from kenaf core using the steam-injection press. The effects of board density, steam pressure, and treatment time on the properties of the board were evaluated. The target board densities were relatively low, ranging from 0.40 to 0.70 g/cm3. The properties [i.e., moduli of rupture (MOR) and elasticity (MOE) in both dry and wet conditions, internal bonding strength (IB), and water absorption (WA)] of the boards increased linearly with increasing board density. Steam pressure and treatment time also affected the board properties. The bending strength and IB were improved with increased steam pressure. A long steam treatment time contributed to low thickness swelling (TS) values and thus better dimensional stability. The appropriate steam pressure was 1.0 MPa, and the treatment time was 10–15 min. The properties for 0.55 g/cm3 density boards under optimum conditions were MOR 12.6 MPa, MOE 2.5 GPa, IB 0.49 MPa, TS 7.5%, and wet MOR 2.4 MPa. Compared with the requirement of JIS 5908, 1994 for particleboard, kenaf binderless boards showed excellent IB strength but relatively poor durability.

Development of new natural polymer-based wood adhesives I: dry bond strength and water resistance of konjac glucomannan, chitosan, and their composites

Abstract Bonding properties of konjac glucomannan (KGM), chitosan, and their composites were investigated. After preparing three-ply plywood glued with these materials, the dry bond strength and the bond strength after water immersion treatment were measured. The bond strength of urea-formaldehyde resin adhesive, casein, and soybean glues was also studied for comparison. KGM developed relatively good dry bond strength in extremely small solid amounts, irrespective of alkaline treatment. However, the water resistance was extremely low for all of the conditions. Chitosan also developed good dry bond strength in small solid amounts and was better than conventional adhesives. Chitosan also exhibited excellent water resistance compared to casein and soybean glues. When KGM and chitosan were combined, the adhesiveness under the dry condition was enhanced, and the bonding properties were superior to those of casein and soybean glues. Therefore, it is expected that chitosan and chitosan–KGM composite can be used as environmentally friendly wood adhesives.

Effects of mat moisture content and press closing speed on the formation of density profile and properties of particleboard

Isocyanate resin-bonded 0.5 and 0.7 g/cm3 lauan (Shorea sp.) particleboards were produced from mats with uniform and distributed moisture content (MC) distributions, using three hot press closing speeds. The effects of these processing variables on the formation of density profile in particleboard and board properties were analyzed statistically. A definition of the density profile was introduced, and the correlations among the various defining factors were established. The results are summarized as follows. (1) The peak density (PD) of particleboard could be increased, with a slight reduction in the core density (CD), using mats with different MC distributions. (2) In a conventional density profile, CD and PD are highly dependent on the board mean density (MD); and the gradient factor (GF), peak distance from the faces (Pdi), and peak base (Pb) are significantly correlated to each other, at the 99% significance level. (3) Greater press closing speed reduces Pdi and Pb, with an increase in GF. (4) Greater press closing speed could increase the PD in board of low MD, with minimal effect on CD. (5) The modulus of elasticity (MOE) of particleboards from mats with high MC near the faces were consistently higher than those from mats with uniform MC, irrespective of the press closing speed, whereas their modulus of rupture (MOR) became indifferent at higher MD under slow and fast closing speeds. (6) Sanding does not improve the MOR and MOE of particleboard significantly.

Chemical changes in steam-pressed kenaf core binderless particleboard

The effects of chemical changes in kenaf core binderless particleboards on the bonding performance and thickness swelling of boards were investigated by chemical and spectroscopic analyses. Mild steam-injection treatments (0.6–1.0 MPa) caused significant degradation of hemicelluloses, lignin, and cellulose. Conventional hot pressing caused a lower degree of degradation of the chemical components. The hot-pressed kenaf core board without any binders showed poor bonding performance. Thus, it was found that partial degradation of the three major chemical components of the kenaf core by mild steam-injection treatment increased the bonding performance and dimensional stability of the binderless boards, and gave better quality binderless boards than those made by hot-pressing treatments.