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Featured researches published by Shunguang Wan.


Review of Scientific Instruments | 2012

A novel driving principle by means of the parasitic motion of the microgripper and its preliminary application in the design of the linear actuator.

Hu Huang; Hongwei Zhao; Zhaojun Yang; Jie Mi; Zunqiang Fan; Shunguang Wan; Chengli Shi; Zhichao Ma

This paper presents a novel driving principle by means of the parasitic motion of the microgripper. Actuators based on this principle can realize the large displacement range and high speed easily. Also the structure can be simple. A parasitic motion principle linear actuator mainly consisting of two piezoelectric stacks, two microgrippers and a mover was designed. Experimental results indicate that at a low driving frequency of 5 Hz, large velocity over 40 μm/s is obtained with the driving voltage of 100 V. Backward motion was observed and analyzed. Experimental results verify the feasibility of the new principle and it can be used to design new linear or rotary actuators.


AIP Advances | 2012

Effect of residual chips on the material removal process of the bulk metallic glass studied by in situ scratch testing inside the scanning electron microscope

Hu Huang; Hongwei Zhao; Chengli Shi; Boda Wu; Zunqiang Fan; Shunguang Wan; Chunyang Geng

Research on material removal mechanism is meaningful for precision and ultra-precision manufacturing. In this paper, a novel scratch device was proposed by integrating the parasitic motion principle linear actuator. The device has a compact structure and it can be installed on the stage of the scanning electron microscope (SEM) to carry out in situ scratch testing. Effect of residual chips on the material removal process of the bulk metallic glass (BMG) was studied by in situ scratch testing inside the SEM. The whole removal process of the BMG during the scratch was captured in real time. Formation and growth of lamellar chips on the rake face of the Cube-Corner indenter were observed dynamically. Experimental results indicate that when lots of chips are accumulated on the rake face of the indenter and obstruct forward flow of materials, materials will flow laterally and downward to find new location and direction for formation of new chips. Due to similar material removal processes, in situ scratch testi...


Materials | 2013

Randomness and Statistical Laws of Indentation-Induced Pop-Out in Single Crystal Silicon

Hu Huang; Hongwei Zhao; Chengli Shi; Lin Zhang; Shunguang Wan; Chunyang Geng

Randomness and discreteness for appearance of pop-out of the single crystal silicon with a (100) orientation were studied by a self-made indentation device. For a given maximum penetration load, the load Ppo for appearance of pop-out fluctuates in a relatively large range, which makes it hard to study the effect of the loading/unloading rate on the load Ppo. Experimental results with different maximum penetration loads indicate that the critical penetration load for appearance of pop-out is in the range of 15 mN~20 mN for the current used single crystal silicon. For a given maximum penetration load, the load Ppo for appearance of pop-out seems random and discrete, but in the point of statistics, it has an obviously increasing trend with increase of the maximum penetration load and also the fraction Ppo/Pmax approximately keeps in the range of 0.2~0.5 for different maximum penetration loads changing from 15 mN to 150 mN.


Review of Scientific Instruments | 2011

Experimental research on a modular miniaturization nanoindentation device

Hu Huang; Hongwei Zhao; Jie Mi; Jie Yang; Shunguang Wan; Zhaojun Yang; Jiwang Yan; Zhichao Ma; Chunyang Geng

Nanoindentation technology is developing toward the in situ test which requires miniaturization of indentation instruments. This paper presents a miniaturization nanoindentation device based on the modular idea. It mainly consists of macro-adjusting mechanism, x-y precise positioning platform, z axis precise driving unit, and the load-depth measuring unit. The device can be assembled with different forms and has minimum dimensions of 200 mm × 135 mm × 200 mm. The load resolution is about 0.1 mN and the displacement resolution is about 10 nm. A new calibration method named the reference-mapping method is proposed to calibrate the developed device. Output performance tests and indentation experiments indicate the feasibility of the developed device and calibration method. This paper gives an example that combining piezoelectric actuators with flexure hinge to realize nanoindentation tests. Integrating a smaller displacement sensor, a more compact nanoindentation device can be designed in the future.


AIP Advances | 2012

A novel and compact nanoindentation device for in situ nanoindentation tests inside the scanning electron microscope

Hu Huang; Hongwei Zhao; Jie Mi; Jie Yang; Shunguang Wan; Lixia Xu; Zhichao Ma

In situ nanomechanical tests provide a unique insight into mechanical behaviors of materials, such as fracture onset and crack propagation, shear band formation and so on. This paper presents a novel in situ nanoindentation device with dimensions of 103mm×74mm×60mm. Integrating the stepper motor, the piezoelectric actuator and the flexure hinge, the device can realize coarse adjustment of the specimen and precision loading and unloading of the indenter automatically. A novel indenter holder was designed to guarantee that the indenter penetrates into and withdraws from the specimen surface vertically. Closed-loop control of the indentation process was established to solve the problem of nonlinearity of the piezoelectric actuator and to enrich the loading modes. The in situ indentation test of Indium Phosphide (InP) inside the scanning electron microscope (SEM) was carried out and the experimental result indicates the feasibility of the developed device.


Sensors | 2012

Design and Analysis of a Compact Precision Positioning Platform Integrating Strain Gauges and the Piezoactuator

Hu Huang; Hongwei Zhao; Zhaojun Yang; Zunqiang Fan; Shunguang Wan; Chengli Shi; Zhichao Ma

Miniaturization precision positioning platforms are needed for in situ nanomechanical test applications. This paper proposes a compact precision positioning platform integrating strain gauges and the piezoactuator. Effects of geometric parameters of two parallel plates on Von Mises stress distribution as well as static and dynamic characteristics of the platform were studied by the finite element method. Results of the calibration experiment indicate that the strain gauge sensor has good linearity and its sensitivity is about 0.0468 mV/μm. A closed-loop control system was established to solve the problem of nonlinearity of the platform. Experimental results demonstrate that for the displacement control process, both the displacement increasing portion and the decreasing portion have good linearity, verifying that the control system is available. The developed platform has a compact structure but can realize displacement measurement with the embedded strain gauges, which is useful for the closed-loop control and structure miniaturization of piezo devices. It has potential applications in nanoindentation and nanoscratch tests, especially in the field of in situ nanomechanical testing which requires compact structures.


Sensors | 2013

A novel two-axis load sensor designed for in situ scratch testing inside scanning electron microscopes.

Hu Huang; Hongwei Zhao; Boda Wu; Shunguang Wan; Chengli Shi

Because of a lack of available miniaturized multiaxial load sensors to measure the normal load and the lateral load simultaneously, quantitative in situ scratch devices inside scanning electron microscopes and the transmission electron microscopes have barely been developed up to now. A novel two-axis load sensor was designed in this paper. With an I-shaped structure, the sensor has the function of measuring the lateral load and the normal load simultaneously, and at the same time it has compact dimensions. Finite element simulations were carried out to evaluate stiffness and modal characteristics. A decoupling algorithm was proposed to resolve the cross-coupling between the two-axis loads. Natural frequency of the sensor was tested. Linearity and decoupling parameters were obtained from the calibration experiments, which indicate that the sensor has good linearity and the cross-coupling between the two axes is not strong. Via the decoupling algorithm and the corresponding decoupling parameters, simultaneous measurement of the lateral load and the normal load can be realized via the developed two-axis load sensor. Preliminary applications of the load sensor for scratch testing indicate that the load sensor can work well during the scratch testing. Taking advantage of the compact structure, it has the potential ability for applications in quantitative in situ scratch testing inside SEMs.


Archive | 2011

Nanoindentation/cutting test device

Hongwei Zhao; Hu Huang; Jie Mi; Jie Yang; Shunguang Wan; Zhichao Ma; Xiaoyue Wang; Yingkun Yuan


Tribology International | 2013

Effects of probe tilt on nanoscratch results: An investigation by finite element analysis

Chengli Shi; Hongwei Zhao; Hu Huang; Shunguang Wan; Zhichao Ma; Chunyang Geng; Luquan Ren


Archive | 2012

Cross-scale micro-nano in-situ three-point bending mechanical performance testing platform

Hongwei Zhao; Xiaoli Hu; Zhichao Ma; Hu Huang; Chengli Shi; Lin Zhang; Peng Zhang; Changsheng Liu; Qinchao Li; Shunguang Wan

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