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Dive into the research topics where Shutao Huang is active.

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Featured researches published by Shutao Huang.


Materials and Manufacturing Processes | 2012

Drilling of SiCp/Al Metal Matrix Composites with Polycrystalline Diamond (PCD) Tools

Shutao Huang; Li Zhou; Jin Lei Chen; Lifu Xu

High-volume-fraction SiCp/Al composites have attracted considerable interest for their excellent thermo-physical properties. However, popularization of high volume fraction SiCp/Al composites is still hampered by their poor machinability. In this study, the influences of the cutting speed and feed rate on the drilling performance of SiCp/Al composites with 56% SiC particles were investigated experimentally. The drilling characteristics were evaluated in terms of drilling forces, tool wear, and the surface quality of drilled-hole. It was found that the feed rate is one of the main cutting parameters that affect the drilling performance, while the cutting speed has no significant effect on the thrust force.


International Journal of Materials Research | 2012

Study of the mechanism of ductile-regime grinding of SiCp/Al composites using finite element simulation

Shutao Huang; Li Zhou; Xiaolin Yu; Lifu Xu

Abstract Based on indentation experiments under different loads, the mechanism of ductile-regime grinding of SiCp/Al composites has been investigated. The factors that influence the ductile-regime removal of SiC particles, such as tip radius of abrasive grains, intrusion depth, and volume fraction of SiC particles, have been analyzed by three-dimensional finite element simulation. The calculation results indicate that a sharp abrasive grain without tip radius cannot produce a plastic deformation region under the indenter and brittle fracture of the SiC particle takes place rather than ductile model of failure. The critical grinding depth of ductile-regime removal decreases with increasing tip radius of abrasive grains, but increases with decreasing SiC particle volume fraction.


Advanced Materials Research | 2012

Influence of Low-Temperature Freezing Treatment on Micro-Area Hardness and Residual Stress of SiCp/Al Composites

Xiaolin Yu; Shutao Huang; Wen Zhen Zhao; Li Zhou

In order to study the effect of freezing treatment on the mechanical properties of SiCp/Al composites, SiCp/Al composites were froze by liquid nitrogen for different time. The micro-area hardness, two-phase residual stress and interface combination status of were analyzed with micro hardness tester, x-ray diffractometer and SEM before and after freezing treatment. The results show that the hardness of Al matrix after freezing is higher than that of before freezing, while the hardness of SiC particles does not show much change. Low-temperature freezing makes the residual compressive stress of matrix phase and the residual tensile stress of reinforcing phase reduce. With the increasing of freezing time, the difference value between the measured residual stress and the primary residual stress of Al matrix and SiC particles both turn out to be greater. Freezing can not destroy the interface combination status between the matrix phase and the reinforcing phase.


International Journal of Materials Research | 2009

The coupled FEM analysis of super-high angular speed polishing of diamond films

Shutao Huang; Li Zhou; Lifu Xu; K. R. Jiao

Abstract Super-high angular speed polishing of diamond films is a new polishing method. During the polishing process, the rotational velocity of the cast iron polishing plate is higher than that of conventional polishing methods, and friction between the polishing plate and the diamond film during rotary motion generates heat that creates a diffusion condition for carbon atoms. The temperature and strain energy density distributions of the polished surface directly affect the polishing quality of diamond films. In this paper, a three-dimensional thermo-mechanical coupled finite element analysis was employed to analyze the temperature and strain energy due to the friction between the polishing plate and the thick diamond film while the polishing plate rotates at super-high angular speed. The results indicate that when the diamond film and polishing plate rotate in the same direction, the differences of temperature and strain energy evidently decrease, and the temperature and strain energy in the diamond film become more uniform. The removal rate by super-high speed polishing has been quantitatively described by the diffusion mechanism, and it agrees well with the experiment data. This work will provide theoretical guidance to the design and operation of the super-high speed polishing of diamond films.


The International Journal of Advanced Manufacturing Technology | 2011

Finite element and experimental studies of the cutting process of SiCp/Al composites with PCD tools.

Li Zhou; Shutao Huang; D. Wang; Xiaolin Yu


The International Journal of Advanced Manufacturing Technology | 2012

Experimental study of high-speed milling of SiCp/Al composites with PCD tools

Shutao Huang; Li Zhou; Xiaolin Yu; Y. Cui


Diamond and Related Materials | 2010

A super-high speed polishing technique for CVD diamond films

Shutao Huang; Li Zhou; Lifu Xu; K.R. Jiao


The International Journal of Advanced Manufacturing Technology | 2013

Numerical and experimental studies on the temperature field in precision grinding of SiCp/Al composites

Li Zhou; Shutao Huang; C.Y. Zhang


The International Journal of Advanced Manufacturing Technology | 2014

An experimental study on formation mechanisms of edge defects in orthogonal cutting of SiCp/Al composites

Li Zhou; Ning Hou; Shutao Huang; Lifu Xu


The International Journal of Advanced Manufacturing Technology | 2015

A study on chip shape and chip-forming mechanism in grinding of high volume fraction SiC particle reinforced Al-matrix composites

Shutao Huang; Xiaolin Yu; Fusong Wang; Lifu Xu

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Lifu Xu

Shenyang Ligong University

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Li Zhou

Shenyang Ligong University

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Xiaolin Yu

Shenyang Ligong University

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Keru Jiao

Shenyang Ligong University

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Huanhu He

Shenyang Ligong University

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Lin Guo

Shenyang Ligong University

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C.Y. Zhang

Shenyang Ligong University

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D. Wang

Shenyang Ligong University

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Dashan Bai

Shenyang Ligong University

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Dejin Zhou

Shenyang Ligong University

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