Shuya Kishimoto

TX and RX Front-Ends for 60GHz Band in 90nm Standard Bulk CMOS

This paper describes the design of a mm-wave power amplifier PA with reliability considerations for hot carrier injection (HCI) degradation. A 60GHz-band single-chip transmitter front- end with an output power of 6dBm for 2.6 Gb/s QPSK modulation and a single-chip receiver front-end are implemented in a standard IV 90 nm CMOS technology.

1.25 Gbps wireless Gigabit ethernet link at 60 GHz-band

A 1.25 Gbps 60 GHz-band full duplex wireless Gigabit Ethernet link has been developed. Direct ASK modulation and demodulation scheme is adopted for the 60 GHz-band transceiver. CPW MMICs and planar filters are flip-chip mounted in TX and RX LTCC MCMs. The wireless Gigabit Ethernet link has the function of converting an optical fiber link to a wireless link seamlessly combining a 60 GHz-band transceiver with a 1000Base-SX optical in/out module. The size is 159/spl times/97/spl times/44 mm/sup 3/.

Wireless uncompressed-HDTV-signal transmission system utilizing compact 60-GHz-band transmitter and receiver

A wireless uncompressed high-definition television (HDTV) signal transmission system utilizing a 60-GHz-band transmitter and two receivers is proposed and developed for indoor use. The system is capable of transmitting video signals with 1080i/720p formats and stereo audio signals as 1-Gb/s serial data stream. The compact transmitter and receiver are highlighted, each size of which is 50 mm /spl times/ 70 mm /spl times/ 15 mm. An output peak power of 10 mW and a minimum received power of -52 dBm are achieved. The wide-beam planar antennas allow less strict alignment for the wireless equipments with a maximum transmission distance of 7 m. Furthermore, path diversity technique is introduced to reduce the opportunities of shadowing by a human body around a television set.

Multiple Sector ID Capture (MIDC): A Novel Beamforming Technique for 60-GHz Band Multi-Gbps WLAN/PAN Systems

A novel beamforming (BF) technique (MIDC: Multiple sector-ID Capture) is proposed for 60-GHz band WLAN/PAN systems. In contrast to conventional BF techniques adopted in 60-GHz band standards, where quasi-omni (Q-omni) antenna radiation patterns are utilized, MIDC precisely detects the best link even when the Q-omni pattern is imperfect. Furthermore, it can reserve multiple antenna settings corresponding to existing communication links in the initial training by making use of the quasi-optical nature of millimeter-waves. This enables fast beam switching when link blockage occurs. The training is executed in short durations by putting together DoA/DoD-estimation and “beam-combining” techniques. The basic function of MIDC is verified experimentally in a simple multipath propagation environment by using our 60-GHz CMOS transceiver LSIs integrated with planar phased-array antennas. MIDC has been adopted in the MAC/PHY specification of the primary 60-GHz band standards: WiGig (Wireless Gigabit Alliance) and IEEE 802.11ad.

A 60-GHz band CMOS phased array transmitter utilizing compact baseband phase shifters

A 60-GHz band phased array transmitter is developed based on 90-nm CMOS process featuring compact baseband phase shifters with ideally zero power consumption. The phase shifter changes an RF signal phase every π/2 by switching baseband signal paths. The transmitter has 6 RF front-ends and 6 phase shifters to implement beam steering function for a 1 × 6 array antenna system. Each of the RF front-ends exhibits typically a power of 0 dBm at 1-dB compression point, a conversion gain of 15 dB, and a 3-dB bandwidth of 600 MHz. By controlling phase shifters, the beam steering from 0 to 60 degree is observed. The chip size is 5 mm × 2.5 mm. The circuit consumes 960 mW at 1.0 V supply.

Wireless 1.25 Gb/s transceiver module at 60 GHz-band

A 1.25 Gb/s 60 GHz-band compact transceiver module uses ASK modulation. CPW MMICs and planar filters are flip-chip mounted in TX and RX LTCC MCMs. The transmitter exhibits 9.6 dBm output power. The receiver shows -50 dBm minimum received power for 1.25 Gb/s error-free transmission. The transceiver module is 82/spl times/53/spl times/7 mm/sup 3/ (30 cc).

60-GHz-band LTCC module technology for wireless gigabit transceiver applications

This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.

60-GHz-band coplanar MMIC active filters

This paper presents the design and performance of 60-GHz-band coplanar monolithic microwave integrated circuit (MMIC) active filters. To compensate for the loss of the passive filter, a resonator composed of a quarter-wavelength line is terminated by a circuit with a constant negative resistance over a wide frequency band. Cross-coupling is introduced to make the attenuation poles on both sides of the passband. We develop two types of two-stage filter: one with medium bandwidth and the other with narrow bandwidth. The former shows an insertion loss of 3.0 dB with a 3-dB bandwidth of 2.6 GHz and a rejection of larger than 20 dB at a 3-GHz separation from a center frequency of 65.0 GHz. This filter also shows a noise figure of 10.5 dB. The latter filter shows an insertion loss of 2.8 dB with a 10-dB bandwidth of 2.1 GHz at a center frequency of 65.0 GHz. It also shows an output power of 5.0 dBm at a 1-dB compression point. The loss variation due to temperature variation is successfully compensated using a gate bias control circuit. The size of the MMIC filters is 2.5 mm/spl times/1.1 mm.

A 60-GHz-band Compact IQ Modulator MMIC for Ultra-high-speed Wireless Communication

A 60-GHz-band compact IQ modulator MMIC with a double-balanced mixer configuration is developed for ultra-high-speed wireless transceivers. The IQ modulator includes asymmetric baluns and an LO driver amplifier in a 2.5 mm times 1.15 mm chip to obtain differential signals in a CPW scheme and to mitigate the requirements for LO input power, respectively. The chip size of the CPW balun is markedly reduced by introducing CPS transmission lines in place of lambda/2-lines. When the fabricated modulator MMIC is operated as an SSB mixer, it shows a conversion gain of -11.1 dB at an LO input power of 0 dBm. Under the vector signal measurements, the fabricated modulator shows EVM values of less than 4 % and 5.5 % for QPSK and 16QAM at a symbol rate of 15 Msps in the carrier frequency range of 59 to 66 GHz

60-GHz-Band CMOS MMIC Technology for High-Speed Wireless Personal Area Networks

This paper presents recent progress on 60-GHz-band MMIC developments based on standard 90-nm CMOS technology. For a low-noise amplifier (LNA), a simple noise model is employed to facilitate efficient design in the millimeter- wave range. For a power amplifier (PA), a reliability issue due to degradation of hot carrier injection should be carefully considered for large-signal operation. To maximize output power while ensuring sufficient lifetime, we have established PA design process including co-simulation technique. The developed LNA achieves a noise figure of 5.7 dB with 13-dB gain at 63 GHz. On the other hand, PA exhibits a saturated output power of 8.5 dBm with 15.2-dB linear gain at 60 GHz with a supply voltage as low as 0.7 V where sufficient lifetime is expected. Finally, transmitter and receiver front-end circuits are demonstrated for 2.6-Gbps QPSK operation.