Simone Raoux

Phase Change Memory

In this paper, recent progress of phase change memory (PCM) is reviewed. The electrical and thermal properties of phase change materials are surveyed with a focus on the scalability of the materials and their impact on device design. Innovations in the device structure, memory cell selector, and strategies for achieving multibit operation and 3-D, multilayer high-density memory arrays are described. The scaling properties of PCM are illustrated with recent experimental results using special device test structures and novel material synthesis. Factors affecting the reliability of PCM are discussed.

Phase-change random access memory: a scalable technology

Nonvolatile RAM using resistance contrast in phase-change materials [or phase-change RAM (PCRAM)] is a promising technology for future storage-class memory. However, such a technology can succeed only if it can scale smaller in size, given the increasingly tiny memory cells that are projected for future technology nodes (i.e., generations). We first discuss the critical aspects that may affect the scaling of PCRAM, including materials properties, power consumption during programming and read operations, thermal cross-talk between memory cells, and failure mechanisms. We then discuss experiments that directly address the scaling properties of the phase-change materials themselves, including studies of phase transitions in both nanoparticles and ultrathin films as a function of particle size and film thickness. This work in materials directly motivated the successful creation of a series of prototype PCRAM devices, which have been fabricated and tested at phase-change material cross-sections with extremely small dimensions as low as 3 nm × 20 nm. These device measurements provide a clear demonstration of the excellent scaling potential offered by this technology, and they are also consistent with the scaling behavior predicted by extensive device simulations. Finally, we discuss issues of device integration and cell design, manufacturability, and reliability.

Phase change memory technology

The authors survey the current state of phase change memory (PCM), a nonvolatile solid-state memory technology built around the large electrical contrast between the highly resistive amorphous and highly conductive crystalline states in so-called phase change materials. PCM technology has made rapid progress in a short time, having passed older technologies in terms of both sophisticated demonstrations of scaling to small device dimensions, as well as integrated large-array demonstrators with impressive retention, endurance, performance, and yield characteristics. They introduce the physics behind PCM technology, assess how its characteristics match up with various potential applications across the memory-storage hierarchy, and discuss its strengths including scalability and rapid switching speed. Challenges for the technology are addressed, including the design of PCM cells for low reset current, the need to control device-to-device variability, and undesirable changes in the phase change material that c...

Phase Change Materials and Their Application to Nonvolatile Memories

Phase change materials are materials that exist in at least two structurally distinct solid phases, an amorphous and one (or more) crystalline phases. Many materials display phase change properties in this sense and can be deposited at least as a thin film in an amorphous phase (low temperature deposition, very thin film) or crystalline phase (high temperature deposition, epitaxy). Often the amorphous and crystalline phases have very different optical and electrical properties stemming from the large differences in structure between the amorphous and the crystalline phases. These differences can be used to store information in technological applications if it is possible to switch the material repeatedly between the two phases and if both phases are stable at operating temperature. The transformation of the metastable amorphous phase to the energetically favorable, stable crystalline phase occurs by heating the material above its crystallization temperature for a time

Write Strategies for 2 and 4-bit Multi-Level Phase-Change Memory

We discuss novel multi-level write algorithms for phase change memory which produce highly optimized resistance distributions in a minimum number of program cycles. Using a novel integration scheme, a test array at 4 bits/cell and a 32 kb memory page at 2 bits/cell are experimentally demonstrated.

Ultra-Thin Phase-Change Bridge Memory Device Using GeSb

An ultra-thin phase-change bridge (PCB) memory cell, implemented with doped GeSb, is shown with < 100muA RESET current. The device concept provides for simplified scaling to small cross-sectional area (60nm2) through ultra-thin (3nm) films; the doped GeSb phase-change material offers the potential for both fast crystallization and good data retention

Crystallization properties of ultrathin phase change films

The crystallization behavior of ultrathin phase change films was studied using time-resolved x-ray diffraction (XRD). Thin films of variable thickness between 1 and 50nm of the phase change materials Ge2Sb2Te5 (GST), N-doped GST, Ge15Sb85, Sb2Te, and Ag- and In-doped Sb2Te were heated in a He atmosphere, and the intensity of the diffracted x-ray peaks was recorded. It was found for all materials that the crystallization temperature increases as the film thickness is reduced below 10nm. The increase depends on the material and can be as high as 200°C for the thinnest films. The thinnest films that show XRD peaks are 2nm for GST and N-GST, 1.5nm for Sb2Te and AgIn-Sb2Te, and 1.3nm for GeSb. This scaling behavior is very promising for the application of phase change materials to solid-state memory technology.

Observation of the Role of Subcritical Nuclei in Crystallization of a Glassy Solid

Catching Glassy Crystallization The initial steps for crystallization are difficult to study in atomic materials because they occur on very small length- and time scales. Measurements can be made on surfaces, or by using colloids as analogs, but ideally one would like to observe the ordering phenomena in atomic solids in bulk. Lee et al. (p. 980; see the Perspective by Gibson) use fluctuation transmission electron microscopy to explore the role of nucleation in propagating crystallization and discovered that formation of subcritical nuclei strongly influences the crystallization process. Fluctuation transmission electron microscopy images nanoscale nuclei and their influence on subsequent crystallization. Phase transformation generally begins with nucleation, in which a small aggregate of atoms organizes into a different structural symmetry. The thermodynamic driving forces and kinetic rates have been predicted by classical nucleation theory, but observation of nanometer-scale nuclei has not been possible, except on exposed surfaces. We used a statistical technique called fluctuation transmission electron microscopy to detect nuclei embedded in a glassy solid, and we used a laser pump-probe technique to determine the role of these nuclei in crystallization. This study provides a convincing proof of the time- and temperature-dependent development of nuclei, information that will play a critical role in the development of advanced materials for phase-change memories.

Threshold field of phase change memory materials measured using phase change bridge devices

The threshold switching effect of phase change memory devices is typically parameterized by the threshold voltage at which this breakdown occurs. Using phase change memory bridge devices of variable length, we prove unambiguously that the important parameter for threshold switching is a critical electrical field and not a threshold voltage. By switching phase change bridge devices from the amorphous-as-deposited state, we obtain threshold fields for Ge15Sb85, Ag- and In-doped Sb2Te, Ge2Sb2Te5, and 4 nm thick Sb devices of 8.1, 19, 56, and 94 V/μm, respectively.

Crystallization times of Ge–Te phase change materials as a function of composition

The crystallization times of Ge–Te phase change materials with variable Ge concentrations (29.5–72.4 at. %) were studied. A very strong dependence of the crystallization time on the composition for as-deposited, amorphous films was confirmed, with a minimum for the stoichiometric composition GeTe. The dependence is weaker for melt-quenched, amorphous material and crystallization times are between one to almost four orders of magnitude shorter than for as-deposited materials. This is promising for applications because recrystallization from the melt-quenched phase is the relevant process for optical and solid state memory, and fast crystallization and weak dependence on compositional variations are desirable.