Sindhu Vudayagiri

High Breakdown-Strength Composites from Liquid Silicone Rubbers

In this paper we investigate the performance of liquid silicone rubbers (LSRs) as dielectric elastomer transducers. Commonly used silicones in this application include room-temperature vulcanisable (RTV) silicone elastomers and composites thereof. Pure LSRs and their composites with commercially available fillers (an anatase TiO2, a core–shell TiO2-SiO2 and a CaCu3Ti4O12 filler) are evaluated with respect to dielectric permittivity, elasticity (Youngs modulus) and electrical breakdown strength. Film formation properties are also evaluated. The best-performing formulations are those with anatase TiO2 nanoparticles, where the highest relative dielectric permittivity of 5.6 is obtained, and with STX801, a core–shell morphology TiO2-SiO2 filler from Evonik, where the highest breakdown strength of 173 V μm−1 is obtained.

Filled liquid silicone rubbers: possibilities and challenges

Liquid silicone rubbers (LSRs) have been shown to possess very favorable properties as dielectric electroactive polymers due to their very high breakdown strengths (up to 170 V/μm) combined with their fast response, relatively high tear strength, acceptable Young’s modulus as well as they can be filled with permittivity enhancing fillers. However, LSRs possess large viscosity, especially when additional fillers are added. Therefore both mixing and coating of the required thin films become difficult. The solution so far has been to use solvent to dilute the reaction mixture in order both to ensure better particle dispersion as well as allowing for film formation properties. We show that the mechanical properties of the films as well as the electrical breakdown strength can be affected, and that the control of the amount of solvent throughout the coating process is essential for solvent borne processes. Another problem encountered when adding solvent to the highly filled reaction mixture is the loss of tension in the material upon large deformations. These losses are shown to be irreversible and happen within the first large-strain cycle.

Bilaterally Microstructured Thin Polydimethylsiloxane Film Production

Thin PDMS films with complex microstructures are used in the manufacturing of dielectric electro active polymer (DEAP) actuators, sensors and generators, to protect the metal electrode from large strains and to assure controlled actuation. The current manufacturing process at Danfoss Polypower A/S produces films with a one-sided microstructured surface only. It would be advantageous to produce a film with both surfaces microstructured, as this increases the film’s performance efficiency. The new technique introduced herein produces bilaterally microstructured film by combining an embossing method with the existing manufacturing process. In employing the new technique, films with microstructures on both surfaces are successfully made with two different liquid silicone rubber (LSR) formulations: 1) pure XLR630 and 2) XLR630 with titanium dioxide (TiO2). The LSR films (∼70 µm) are cast on a carrier web substrate using a coating blade. The carrier web, which has a sinusoidal corrugation with wave height of 7 µm and a wave period of 7 µm on its surface, imparts corrugations to the bottom surface of the film. The elastomer film on the carrier web is preheated to the gel point, where the elastomer film can retain an imprint made on it. The preheated film at gel point is embossed between the rolls of a gravure lab coater, which corrugates the top surface of the film. The films are then heated, in order to cure completely. For the LSR systems used in this process, the optimum conditions for preheating are 110°C for 4–7 s, while for embossing the temperature is 110°C with 25 psi pressure between the rolls at a speed of 1.4 rpm. Scanning electron microscope (SEM) images confirm the formation of microstructures on both the surfaces of the film. GRAPHICAL ABSTRACT

Hot embossing of microstructures on addition curing polydimethylsiloxane films

The aim of this research work is to establish a hot embossing process for addition curing vinyl-terminated polydimethylsiloxane (PDMS), which are thermosetting elastomers, based on the existing and widely applied technology for thermoplasts. To our knowledge, no known technologies or processes are commercially available for embossing microstructures and submicron structures on elastomers like silicones in large scale production of films. The predominantly used technologies to make microscale components for microfluidic devices and microstructures on PDMS elastomer is (a) reaction injection molding, (b) ultraviolet lithography, and (c) photolithography. We focus on hot embossing as it is one of the simplest, most cost-effective, and time-saving methods for replicating structures for thermoplasts. Addition curing silicones are shown to possess the ability to capture and retain an imprint made on it, 10–15 min after the gel point at room temperature. This property is exploited in the hot embossing technology.

Techniques for hot embossing microstructures on liquid silicone rubbers with fillers

Embossing is an established process for the thermoplastic elastomers but not yet for the thermosetting elastomers. It has already been shown that hot embossing is a viable technology for imprinting microstructures in addition to curing thin silicone films at their gel point. It is one of the simplest, most cost-effective, and time-saving methods for replicating microstructures. In the present study, films made from liquid silicone rubber (LSR) formulations containing fillers are hot embossed under modified operating conditions. The use of such relatively hard silicone elastomers shows the versatility of this method that has been established for softer silicone elastomers. Also, as a proof of concept, a microstructured metal (nickel (Ni)) plate is used as an embosser for the films successfully. The ideal condition for hot embossing the LSR formulation (XLR 630 with titanium dioxide fillers) with a Ni embosser is 110°C preheating for 15–35 s, embossed with 2 bar pressure, and postheating for complete curing at 110°C for 3 min showing that the process is extremely fast.

Hot-embossing of microstructures on addition-curing polydimethylsiloxane films

To our knowledge no known technologies or processes are commercially available for embossing microstructures and sub-micron structures on elastomers like silicones in large scale production of films. The predominantly used technologies to make micro-scale components for micro-fluidic devices and microstructures on PDMS elastomer are 1) reaction injection molding 2) UV lithography and 3) photolithography, which all are time-consuming and not suitable for large scale productions. A hot-embossing process to impart micro-scale corrugations on an addition curing vinyl terminated PDMS (polydimethyl siloxane) film, which is thermosetting elastomer, was established based on the existing and widely applied technology for thermoplasts. We focus on hot-embossing as it is one of the simplest, most costeffective and time saving methods for replicating structures for thermoplasts. Addition curing silicones are shown to possess the ability to capture and retain an imprint made on it 10-15 minutes after the gel-point at room temperature. This property is exploited in the hot-embossing technology.