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international conference on solid state and integrated circuits technology | 1995

A research on power complementary bipolar technology to prevent parasitic operation

Ju Han Kim; Chung-woo Kim; Hyun-koo Kang; Yu-Na Jang; So-young Lim

A 2 /spl mu/m design ruled, High-Densified, and Low-Power-Consuming Bipolar Integrated Circuit process has been developed. The breakdown voltage of the transistor is 15 V and it has a stable current driving capability at high current (about 1 A) due to the low saturation voltage between emitter and collector. NPN Tr. has been fabricated to prevent leakage current and has good Cut-Off frequency (fT=5 GHz) by using a polysilicon emitter. The characteristics of this process is a Double Epi Process to form a high concentrated N+BL in VPNP Tr. (that is the same as in NPN Tr.) which can protect the parasitic Tr. operation like Latch-Up Phenomenon (Ihold=26 mA, Pa-PNP Tr, hFE=4). And it also includes the IIL Device without an additional mask layer. This process is a low voltage, high current power complementary bipolar process that merges a variety of NPN, VPNP, LPNP, SPNP, IIL devices, and a diffusion resistor.


Archive | 2010

Semiconductor packages including heat slugs

Yong-Hoon Kim; Hee-Seok Lee; Eunseok Cho; Hyun-A Kim; So-young Lim; Pa-Lan Lee


Archive | 2011

Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure

Donghan Kim; Sung-Woo Park; Jin-woo Park; So-young Lim; Jung-Hwan Kim; Kwangjin Bae; Pa-Lan Lee


Archive | 2009

Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same

So-young Lim; Sang-Heui Lee


Archive | 2010

SEMICONDUCTOR PACKAGE INCLUDING POWER BALL MATRIX AND POWER RING HAVING IMPROVED POWER INTEGRITY

Eun seok Song; Hee Seok Lee; Hyun-A Kim; So-young Lim


Archive | 2014

CHIP ON FILM PACKAGE INCLUDING DISTRIBUTED VIA PLUGS

So-young Lim; Na-Rae Shin; Jeong-kyu Ha; Kyoung-Suk Yang; Pa-Lan Lee


Archive | 2013

Chip on Film (COF) Substrate, COF Package and Display Device Including the Same

Jeong-kyu Ha; KwanJai Lee; Jae-Min Jung; Kyong-soon Cho; Na-Rae Shin; Kyoung-Suk Yang; Pa-Lan Lee; So-young Lim


Archive | 2011

SEMICONDUCTOR DEVICE WITH INTERPOSER AND METHOD MANUFACTURING SAME

Yun-seok Choi; So-young Lim; In-won O


Archive | 2011

SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME

Na-Rae Shin; So-young Lim; Chul-Woo Kim; Yechung Chung


Archive | 2017

FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AND DISPLAY DEVICE INCLUDING THE SAME

So-young Lim; Jae-Min Jung; Jeong-kyu Ha; Donghan Kim

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