Son T. Lu

The dual diaphragm pump

This paper reports a major advancement in gas pumping at micro- and meso-scale, made possible by the newly developed, electrostatically actuated, dual-diaphragm pump (DDP). The DDP uses a conformal pumping chamber and two electrostatically actuated, structured diaphragms, to achieve perfect rectification. The DDP demonstrates flow rates of about 30 ml/min and a power consumption of about 8 mW at an overall pump volume of about 1.5/spl times/1.5/spl times/0.1 cm/sup 3/. The DDP is fully symmetrical, having true bidirectional operation; has essentially zero dead space; and is fully scalable. For increased throughput the individual pumping channels can be built in 1D, 2D and 3D arrays. This feature allows the optimization of the individual pumping channel for best performance under electrostatic actuation, but allows scaling of the pumping rate to the desired level. Arrays of 2/spl times/3/spl times/5 pumps have been successfully demonstrated. A DDP array pumping 4 liters per minute will be about 4 times smaller in volume and will use about 4 times less power than the most advanced commercially available air pumps.

A Manufacturable Chip-Scale Atomic Clock

Several factors are converging to enable atomic clocks to be manufactured with very small dimensions and run at low operating power. MOEMS technology, high-speed vcsels, microelectronics, wafer-scale packaging, and the all-optical CPT method of exciting atomic transitions are key ingredients in the quest to make precision time-keeping devices with chip-scale dimensions. In this paper we report on the design and process that enable an atomic clock to be made with a total volume of 1.7 cm3, a total power budget of 57 mWatts, and an Allan Deviation at 1 hour of 5E-12.

Ball-grid array architecture for microfabricated ion traps

State-of-the-art microfabricated ion traps for quantum information research are approaching nearly one hundred control electrodes. We report here on the development and testing of a new architecture for microfabricated ion traps, built around ball-grid array (BGA) connections, that is suitable for increasingly complex trap designs. In the BGA trap, through-substrate vias bring electrical signals from the back side of the trap die to the surface trap structure on the top side. Gold-ball bump bonds connect the back side of the trap die to an interposer for signal routing from the carrier. Trench capacitors fabricated into the trap die replace area-intensive surface or edge capacitors. Wirebonds in the BGA architecture are moved to the interposer. These last two features allow the trap die to be reduced to only the area required to produce trapping fields. The smaller trap dimensions allow tight focusing of an addressing laser beam for fast single-qubit rotations. Performance of the BGA trap as characterized with

MEMS Mega-pixel Micro-thruster Arrays for Small Satellite Stationkeeping

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Chip-scale atomic clock with two thermal zones

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FABRICATION TECHNIQUES TO ENHANCE PRESSURE UNIFORMITY IN ANODICALLY BONDED VAPOR CELLS

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APPARATUS AND METHODS FOR ALKALI VAPOR CELLS

ions is comparable to previous surface-electrode traps in terms of ion heating rate, mode frequency stability, and storage lifetime. We demonstrate two-qubit entanglement operations with

Designs and processes for thermally stabilizing a vertical cavity surface emitting laser (vcsel) in a chip-scale atomic clock

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Design and processes for stabilizing a vcsel in a chip-scale atomic clock

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Electric field assisted solder bonding

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