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Dive into the research topics where Souvik Pal is active.

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Featured researches published by Souvik Pal.


Journal of Chemical Physics | 2012

Modifying thermal transport in electrically conducting polymers: Effects of stretching and combining polymer chains

Souvik Pal; Ganesh Balasubramanian; Ishwar K. Puri

If their thermal conductivity can be lowered, polyacetylene (PA) and polyaniline (PANI) offer examples of electrically conducting polymers that can have potential use as thermoelectrics. Thermal transport in such polymers is primarily influenced by bonded interactions and chain orientations relative to the direction of heat transfer. We employ molecular dynamics simulations to investigate two mechanisms to control the phonon thermal transport in PANI and PA, namely, (1) mechanical strain and (2) polymer combinations. The molecular configurations of PA and PANI have a significant influence on their thermal transport characteristics. The axial thermal conductivity increases when a polymer is axially stretched but decreases under transverse tension. Since the strain dependence of the thermal conductivity is related to the phonon scattering among neighboring polymer chains, this behavior is examined through Hermans orientation factor that quantifies the degree of chain alignment in a given direction. The conductivity is enhanced as adjacent chains become more aligned along the direction of heat conduction but diminishes when they are orthogonally oriented to it. Physically combining these polymers reduces the thermal conductivity, which reaches a minimum value for a 2:3 PANI/PA chain ratio.


Applied Physics Letters | 2013

Reducing thermal transport in electrically conducting polymers: Effects of ordered mixing of polymer chains

Souvik Pal; Ganesh Balasubramanian; Ishwar K. Puri

Reducing the phonon thermal conductivity of electrically conducting polymers can facilitate their use as potential thermoelectric materials. Thus, the influence of the coupling between the longitudinal and transverse phonon modes on overall thermal conductivity is explored for binary mixtures of polyaniline (PANI) and polyacetylene (PA) chains by considering various geometric polymer mixture configurations. The molecular simulations reveal that an increase in the interfacial area available for transverse interactions between dissimilar chains enhances atomic interactions that are orthogonal to the heat transfer direction. As transverse collisions between PA and PANI chains are enhanced, the motion of longitudinal phonons is disrupted, impeding thermal transport. This enhances phonon scattering and reduces longitudinal thermal transport. While there is a nonlinear decrease in the phonon thermal conductivity with increasing interfacial contact area, there is a corresponding linear growth in the nonbonded in...


Nanotechnology | 2014

Thermal rectification in a polymer-functionalized single-wall carbon nanotube

Souvik Pal; Ishwar K. Puri

Thermal rectification occurs when heat current through a material is favored in one direction but not in the opposite direction. These materials, often called thermal diodes, have the potential to perform logic calculations with phonons. Rectification obtained with existing material systems is either too minor or too difficult to implement practically. Hence, we present a scheme to enable higher rectification using a single-wall carbon nanotube (SWCNT) that is covalently functionalized near one end with polyacetylene (PA) chains. This composite structure allows rectification R up to 204%, which is higher than the values reported for SWCNTs. Here, [Formula: see text], where [Formula: see text] and [Formula: see text] are the heat currents for forward and reverse bias, respectively. The interatomic interactions in the SWCNT-PA nanocomposite are nonlinear, i.e., they are anharmonic, which is a requirement for thermal rectification. Through atomistic simulations, we identify two additional conditions to accomplish thermal rectification at the nanoscale, namely, (1) structural asymmetry, and (2) that the influence of this asymmetry on thermal transport is temperature dependent. The optimum temperature difference to achieve the highest thermal rectification with the structure is 40-80 K.


Langmuir | 2015

Numerical Simulations of the Digital Microfluidic Manipulation of Single Microparticles.

Chuanjin Lan; Souvik Pal; Zhen Li; Yanbao Ma

Single-cell analysis techniques have been developed as a valuable bioanalytical tool for elucidating cellular heterogeneity at genomic, proteomic, and cellular levels. Cell manipulation is an indispensable process for single-cell analysis. Digital microfluidics (DMF) is an important platform for conducting cell manipulation and single-cell analysis in a high-throughput fashion. However, the manipulation of single cells in DMF has not been quantitatively studied so far. In this article, we investigate the interaction of a single microparticle with a liquid droplet on a flat substrate using numerical simulations. The droplet is driven by capillary force generated from the wettability gradient of the substrate. Considering the Brownian motion of microparticles, we utilize many-body dissipative particle dynamics (MDPD), an off-lattice mesoscopic simulation technique, in this numerical study. The manipulation processes (including pickup, transport, and drop-off) of a single microparticle with a liquid droplet are simulated. Parametric studies are conducted to investigate the effects on the manipulation processes from the droplet size, wettability gradient, wetting properties of the microparticle, and particle-substrate friction coefficients. The numerical results show that the pickup, transport, and drop-off processes can be precisely controlled by these parameters. On the basis of the numerical results, a trap-free delivery of a hydrophobic microparticle to a destination on the substrate is demonstrated in the numerical simulations. The numerical results not only provide a fundamental understanding of interactions among the microparticle, the droplet, and the substrate but also demonstrate a new technique for the trap-free immobilization of single hydrophobic microparticles in the DMF design. Finally, our numerical method also provides a powerful design and optimization tool for the manipulation of microparticles in DMF systems.


Small | 2015

Thermal AND Gate Using a Monolayer Graphene Nanoribbon

Souvik Pal; Ishwar K. Puri

The first ever implementation of a thermal AND gate, which performs logic calculations with phonons, is presented using two identical thermal diodes composed of asymmetric graphene nanoribbons (GNRs). Employing molecular dynamics simulations, the characteristics of this AND gate are investigated and compared with those for an electrical AND gate. The thermal gate mechanism originates through thermal rectification due to asymmetric phonon boundary scattering in the two diodes, which is only effective at the nanoscale and at the temperatures much below the room temperature. Due to the high phonon velocity in graphene, the gate has a fast switching time of ≈100 ps.


Journal of Computational Physics | 2015

Symmetry boundary condition in dissipative particle dynamics

Souvik Pal; Chuanjin Lan; Zhen Li; E. Daniel Hirleman; Yanbao Ma

Dissipative particle dynamics (DPD) is a coarse-grained particle method for modeling mesoscopic hydrodynamics. Most of the DPD simulations are carried out in 3D requiring remarkable computation time. For symmetric systems, this time can be reduced significantly by simulating only one half or one quarter of the systems. However, such simulations are not yet possible due to a lack of schemes to treat symmetric boundaries in DPD. In this study, we propose a numerical scheme for the implementation of the symmetric boundary condition (SBC) in both dissipative particle dynamics (DPD) and multibody dissipative particle dynamics (MDPD) using a combined ghost particles and specular reflection (CGPSR) method. We validate our scheme in four different configurations. The results demonstrate that our scheme can accurately reproduce the system properties, such as velocity, density and meniscus shapes of a full system with numerical simulations of a subsystem. Using a symmetric boundary condition for one half of the system, we demonstrate about 50% computation time saving in both DPD and MDPD. This approach for symmetric boundary treatment can be also applied to other coarse-grained particle methods such as Brownian and Langevin Dynamics to significantly reduce computation time.


Applied Physics Letters | 2018

Altering thermal transport by strained-layer epitaxy

Tahereh Majdi; Souvik Pal; Anders Hafreager; Sohail Murad; Rakesh P. Sahu; Ishwar K. Puri

Since strain changes the interatomic spacing of matter and alters electron and phonon dispersion, an applied strain can modify the thermal conductivity k of a material. We show how the strain induced by heteroepitaxy is a passive mechanism to change k in a thin film. Molecular dynamics simulations of the deposition and epitaxial growth of ZnTe thin films provide insights into the role of interfacial strain in the conductivity of a deposited film. ZnTe films grow strain-free on lattice-matched ZnTe substrates, but similar thin films grown on a lattice-mismatched CdTe substrate exhibit ∼6% biaxial in-plane tensile strain and ∼7% uniaxial out-of-plane compressive strain. In the T = 700 K–1100 K temperature range, the conductivities of strained ZnTe layers decrease to ∼60% of their unstrained values. The resulting understanding of dk/dT shows that strain engineering can be used to alter the performance of a thermal rectifier and also provides a framework for enhancing thermoelectric devices.


International Journal of Heat and Mass Transfer | 2014

Thermal energy storage in porous materials with adsorption and desorption of moisture

Souvik Pal; Muhammad R. Hajj; William P. Wong; Ishwar K. Puri


International Journal of Thermal Sciences | 2017

Recipe for optimizing a solid-state thermal rectifier

Tahereh Majdi; Souvik Pal; Ishwar K. Puri


International Journal of Heat and Mass Transfer | 2018

Real-time temperature predictions in IT server enclosures

Hosein Moazamigoodarzi; Souvik Pal; Suvojit Ghosh; Ishwar K. Puri

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Chuanjin Lan

University of California

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Yanbao Ma

University of California

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