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Stefan Fruhnert

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Publication

Featured researches published by Stefan Fruhnert.

Archive | 2008

Heat conducting material for forming heat conductive intermediate layer between a heat source and a heat sink, comprises phase change material formed as first material component and heat conducting fiber formed as second material component

Stefan Fruhnert; Martin Helsper

Archive | 2007

Trägeraufbau für einen Leistungsbaustein mit einem Kühlkörper und Verfahren zu dessen Herstellung

Stefan Fruhnert; Martin Helsper

Archive | 2007

Heat-conductive material layer manufacturing method, involves inserting fibers in field area and transporting towards carrier layer, where fibers have large heat-conductivity toward fiber longitudinal direction than other direction

Stefan Fruhnert; Martin Helsper

Archive | 2014

Method for labelling a component

Stefan Fruhnert; Stefanie Haberer; Achim Hilpert

Archive | 2007

Heat conducting material layer production method for use in solar technology, involves elongation of multiple nodular fibers in longitudinal direction having heat conductivity more than in another direction

Stefan Fruhnert; Martin Helsper

Archive | 2007

Carrier structure for electronic conducting component, has radiator box with radiator box upper side, and electrically isolating carrier layer is provided with carrier layer lower surface

Stefan Fruhnert; Martin Helsper

Archive | 2013

Verfahren zur Beschriftung eines Bauteils

Stefan Fruhnert; Stefanie Haberer; Achim Hilpert

Archive | 2010

Semiconductor module i.e. power semiconductor module, has filling compound provided in part of housing, and containing non-hardening, thermoplastic polymer with reversible phase change characteristics

Stefan Fruhnert; Martin Helsper

Archive | 2008

Thermal and electrical contact material for forming thermal and electrical conductive intermediate layer between two contact areas of an electric contact position, comprises matrix base material, swelling material and a fiber

Stefan Fruhnert; Martin Helsper; Hans-Joachim Knaak

Archive | 2007

Carrier structure for electronic power component e.g. semiconductor component such as diode, has fixed connection existing between base plate and carrier layer, where connection is frictional, form-fitting or material closure connection

Stefan Fruhnert; Martin Helsper

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Martin Helsper

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Achim Hilpert

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Hans-Joachim Knaak

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Stefanie Haberer

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