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Dive into the research topics where Stefan Groetsch is active.

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Featured researches published by Stefan Groetsch.


SID Symposium Digest of Technical Papers | 2005

58.3: A New LED Light Source For Projection Applications

Gerhard Kuhn; Stefan Groetsch; Nicole Breidenassel; Wolfgang Schnabel; Stefan Wallner

A new kind of LED light source with high brightness levels suitable for use in ultra-compact projection devices was developed. We present a unique chip technology and the correctly matched package design that enable a superior performance and discuss all of the aspects of using this LED light source in a projection application.


Optoelectronics '99 - Integrated Optoelectronic Devices | 1999

Highly reliable 40-W cw InGaAlAs/GaAs 808-nm laser bars

Christian Hanke; L. Korte; Bruno Acklin; Johann Luft; Stefan Groetsch; Gerhard Herrmann; Zeljko Spika; Marcel Marchiano; Bernhard DeOdorico; Jens Wilhelmi

The fundamental question whether aluminum-free semiconductor lasers in the 808 nm band are significantly more reliable than Al-containing lasers is still open. We have fabricated and tested high-power InGaAlAs/GaAs-lasers which show excellent reliability data at and above 40 W cw. The laser structure consists of an InGaAlAs-double-quantum well (DQW) as active layer embedded in a large optical cavity (LOC) waveguide structure. The layers were grown in a low pressure MOVPE (LP- MOVPE) reactor using high quality precursors. Asymmetrically coated bars with a width of 1 cm containing 25 groups of 200 micrometer wide emitters were mounted junction down on actively cooled heatsinks. At a heatsink temperature of 18 degrees Celsius the slope-efficiency is 1.1 - 1.2 W/A. Due to the low series-resistance of 2.2 m(Omega) and the low internal losses in the range of 1.7 cm-1 the overall efficiency at 40 W cw reaches 50%. Lifetime studies over 33 0000 h accumulated device hours show that the laser bars with a resonator length of 900 micrometer can be operated at 40 W with high reliability. The mean degradation rate is -0.11%/kh. This result emphasizes that Al-containing lasers can also have a very high reliability usually claimed for Al-free lasers. As a consequence of these encouraging results we will start further lifetime tests at 50 to 60 W.


Proceedings of SPIE | 2010

LED light sources for mobile embedded projection

Stefan Morgott; Stefan Groetsch; Wolfgang Schnabel; Daniel Wiener

We present a LED light source solution based on a variable chip and package platform for color sequential embedded pico projection. These RGB LEDs are optimized to fulfill the requirements on luminous efficacy (lm/W), size and cost for a variety of pico projector engine designs. Efficacies of 7-10lm at 1W can be achieved for DMD™ and LCoS based projector systems with engine sizes <10cc.


In-Plane Semiconductor Lasers V | 2001

High-power laser bars for 70-W cw (808 nm): a comparison between SQW and DQW

Martin Behringer; Gerhard Herrmann; Stefan Groetsch; W. Teich; Johann Luft; Bruno Acklin; Lutz Korte; Christian Hanke; Marcel Marchiano

We have investigated the degradation behavior of high power diode-laser bars at 80 nm with single quantum and double quantum well structures in continuous wave operation. The 1 cm bars have a fill factor of 50%. Laser diodes with different resonator lengths from 300 micrometers to 2000 micrometers have been investigated. Different bars were mounted on actively cooled submounts and operated at comparable current densities and heat load.


2016 6th Electronic System-Integration Technology Conference (ESTC) | 2016

A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems

Hermann Oppermann; Morten Brink; Oswin Ehrmann; Stefan Groetsch; Andreas Plössl; Alexander F. Pfeuffer; Norwin von Malm; Thomas Gross; Roland Fiederling; Ronny Kürschner; Klaus-Dieter Lang

Pixelated LEDs are a new, high efficient light source which allows to control the beam pattern and which are therefore suitable for adaptive front light systems. We will present a concept for hybrid 3D flip chip stacking of pixelated LED chips onto an active matrix driver IC using a new interconnect structure to address thermal management and bonding robustness challenges. Two types of interconnect materials have been investigated: electroplated AuSn solder and nanoporous gold (NPG). We will present the deposition methods and the bonding approach for chip-to-chip and chip-to-wafer bonding and the characteristic results of the bonded interconnects achieved.


Archive | 2011

Semiconductor Laser Light Source

Stephan Lutgen; Stefan Groetsch


Archive | 2009

Surface-mounted led module and method for producing a surface-mounted led module

Stefan Groetsch; Ewald Karl Michael Guenther; Alexander Wilm; Siegfried Herrmann


Archive | 2004

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Stefan Groetsch; Stefan Illek; Andreas Ploessl; Berthold Hahn


Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XIV | 2010

High efficiency green LEDs using II-VI color converters

Thomas J. Miller; Michael A. Haase; Xiaoguang Sun; Bing Hao; Jun-Ying Zhang; Terry L. Smith; Todd A. Ballen; Junqing Xie; Amy S. Barnes; Fedja Kecman; Joseph Yang; James Thielen; Catherine A. Leatherdale; Ralph Wirth; Andreas Biebersdorf; Karl Engl; Stefan Groetsch


Archive | 1996

Micro-optical device for transforming beams of a laser diode array and method for the production of such a device

Werner Spaeth; Stefan Groetsch; Ralf Dipl-Ing Fh Moser; Georg Bogner

Collaboration


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Georg Bogner

Osram Opto Semiconductors GmbH

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Bruno Acklin

Osram Opto Semiconductors GmbH

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Frank Singer

Osram Opto Semiconductors GmbH

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Michael Brandl

Osram Opto Semiconductors GmbH

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Thomas Zeiler

Osram Opto Semiconductors GmbH

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Alexander Sauerer

Osram Opto Semiconductors GmbH

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Alexander Wilm

Osram Opto Semiconductors GmbH

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Berthold Hahn

Osram Opto Semiconductors GmbH

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Gerhard Herrmann

Osram Opto Semiconductors GmbH

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