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Stefan Schneidewind

SUSS MicroTec

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Publication

Featured researches published by Stefan Schneidewind.

Archive | 2003

Test apparatus with loading device

Karsten Stoll; Stefan Kreissig; Alf Wachtveitl; Michael Teich; Stefan Schneidewind; Claus Dietrich; Jörg Dr. Kiesewetter; Dietmar Runge

Archive | 2001

Tester for pressure sensors

Claus Dietrich; Botho Hirschfeld; Dietmar Runge; Michael Teich; Stefan Schneidewind

Archive | 2003

Test apparatus for testing substrates at low temperatures

Stefan Schneidewind; Claus Dietrich; Jörg Kiesewetter; Frank-Michael Werner; Axel Schmidt; Matthias Zieger

Archive | 2004

Substrate testing apparatus, has substrate carrier to receive and hold substrate in releasable thermal contact, and directly cooled thermal radiation shield protecting substrate from thermal radiation

Claus Dr.-Ing. Dietrich; Jörg Kiesewetter; Axel Schmidt; Stefan Schneidewind; Hans-Michael Werner; Matthias Zieger

Archive | 2004

Apparatus for testing substrates

Stefan Schneidewind; Claus Dietrich; Frank-Michael Werner; Don Feuerstein; Mike Lancaster; Denis Place

Archive | 2002

Prober zum Testen von Substraten bei tiefen Temperaturen

Claus Dr.-Ing. Dietrich; Jörg Dr. Kiesewetter; Axel Schmidt; Stefan Schneidewind; Hans-Michael Werner; Matthias Zieger

Archive | 2004

Method and prober for contacting a contact area with a contact tip

Stefan Schneidewind; Claus Dietrich; Jörg Dr. Kiesewetter; Stojan Kanev; Stefan Kreissig; Frank Fehrmann; Hans-Jürgen Fleischer

Archive | 2004

Contact area contacting method for prober, involves observing vertical movement of semiconductor wafer along observation axis which runs in plane that is slight distance away from free wafer surface in its expected end position

Claus Dietrich; Frank Fehrmann; Hans-Jürgen Fleischer; Stojan Kanev; Jörg Kiesewetter; Stefan Kreissig; Stefan Schneidewind

Archive | 2009

Method for increasing the accuracy of the positioning of a first object relative to a second object

Stefan Schneidewind; Claus Dietrich; Jörg Dr. Kiesewetter; Michael Teich; Thomas Thärigen

Archive | 2004

Semiconductor wafer testing arrangement used in semiconductor production, has temperature control station that transfers wafer to prober through handling system, after applying thermal or mechanical load to wafer

Claus Dr.-Ing. Dietrich; Don Feuerstein; Mike Lancaster; Denis Place; Stefan Schneidewind; Frank-Michael Werner

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Collaboration

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Claus Dietrich

SUSS MicroTec

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Michael Teich

SUSS MicroTec

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Jörg Dr. Kiesewetter

Cascade Microtech

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Claus Dr.-Ing. Dietrich

SUSS MicroTec

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Frank-Michael Werner

Cascade Microtech

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Dietmar Runge

SUSS MicroTec

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Don Feuerstein

SUSS MicroTec

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Thomas Thärigen

SUSS MicroTec

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Axel Schmidt

SUSS MicroTec

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Denis Place

SUSS MicroTec

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