Sulaman Pashah
King Fahd University of Petroleum and Minerals
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 | 2011
Sulaman Pashah; A.F.M. Arif
Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.Copyright
ASME 2013 International Mechanical Engineering Congress and Exposition | 2013
Sulaman Pashah; Syed M. Zubair; A.F.M. Arif
The use of dimensional analysis and dimensionless parameters is very common in the field of heat transfer. The paper presents a non-dimensional finite element capable of modeling combined heat and mass transfer from fins. The aim of the formulation is to get solution of the fin problems that do not have a closed form solution. The performance of a fin is described through its efficiency and numerous closed form solutions for fin efficiency under combined heat and mass transfer are available in the literature. Deriving a closed form solution for geometric or material complexities is somewhat a difficult task. An example is variable profile composite fin. A composite fin is composed of base material or substrate with a coating layer. Finite element approach can handle such complexity with relatively ease, Therefore the main objective is to developed formulation for mass transfer problems. The formulation is derived in dimensionless form to extend the applicability of finite element results to a class of problems with same governing dimensionless parameters. The derived formulation is then applied to study the combined heat and mass transfer for variable profile composite fins under fully wet condition.© 2013 ASME
Volume 2: Applied Fluid Mechanics; Electromechanical Systems and Mechatronics; Advanced Energy Systems; Thermal Engineering; Human Factors and Cognitive Engineering | 2012
Sulaman Pashah; A.F.M. Arif; Syed M. Zubair
The use of dimensional analysis and dimensionless parameters is very common in the field of heat transfer; nevertheless the concept of non-dimensional finite element formulation has been applied to a limited type of thermo-fluid problems. The non-dimensional finite element method should provide the dimensionless solution for a given problem. The aim of present work is to develop a non-dimensional thermal finite element for getting dimensionless solution of the problems that do not have a closed form solution. An example is a fin (or extended surface) design. Fin efficiency is a performance characteristic that can be used as design criterion; thus closed form dimensionless solutions for fin efficiency are available in the literature. The results are for different geometry, single material fins. In case, if the fin problem has some geometric and/or material complexities then closed form solutions are not available and finite element approach can be used. However, the obtained finite element solution would not be in dimensionless form. For example, no closed form solutions are available for variable thickness composite fins (i.e. a fin having a base material with a coating over its surface), and the literature shows that finite element solution has been used to study thermal performance of the variable thickness composite fins. Therefore, non-dimensional finite element approach can be applied to directly obtain the dimensionless solution for the problem. The current work consists of presenting a non-dimensional finite element formulation for thermal problems. The element formulation is first validated by solving a test case study that has known closed form solution. The objective is to demonstrate the usefulness of the non-dimensional finite element approach by obtaining dimensionless finite element solutions for some applied problems that do not have a closed form solution.Copyright
ASME 2010 International Mechanical Engineering Congress and Exposition | 2010
A.F.M. Arif; Sulaman Pashah; Syed M. Zubair; Muhammad Inam
Thermal management of electronic products relies on the effective dissipation of heat. Heat sink elements (e.g. a pin fin) are used for any effective heat dissipation network. Despite much optimized design of the heat sink element, the heat transfer may not be effective because the interface between power device and heat sink element is critical in the heat dissipation network. Thermal Interface Materials TIM (e.g. adhesive, solder, pads, or pastes) are employed at interface between power device and heat sink element to minimize the interface thermal resistance. However, several challenges need to be addressed before they can be successfully utilized because depending on the thermal interface conditions, the thermal stress level can attain undesirable values. This issue can be addressed by the optimization of the system design with the help of simulation methods. Generally the effects of interface conditions are studied on the thermal performance of the heat sink system whereas in this paper, a coupled-field (thermal-structural) analysis using FEM is performed to study the thermal as well as structural behavior of the heat sink system. Temperature variation and stress fields in the region of interface between pin fin and base plate are analyzed. Effects of various parameters (such as contact pressure, surface roughness, TIM thickness, and operating conditions) on the resulting thermal and structural response at the interface are presented. It has been found that different interface conditions may have comparable thermal performance with significant different stress fields at the interface. Therefore stress state must be known to ensure the structural integrity of the heat sink system for a given operating condition.Copyright
International Journal of Refrigeration-revue Internationale Du Froid | 2016
Sulaman Pashah; Abdurrahman Moinuddin; Syed M. Zubair
Applied Thermal Engineering | 2013
Sulaman Pashah; A.F.M. Arif; Syed M. Zubair; Muhammad Inam
International Journal of Refrigeration-revue Internationale Du Froid | 2017
Sulaman Pashah; Abdurrahman Moinuddin; Syed M. Zubair
Archive | 2013
Muhammad Sulaiman Farhan Al Madri Al Fifi; Sulaman Pashah
Journal of Electronic Packaging | 2012
A.F.M. Arif; Syed M. Zubair; Sulaman Pashah
International Journal of Adhesion and Adhesives | 2016
Khaled S. Al-Athel; A.F.M. Arif; Sulaman Pashah
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Muhammad Sulaiman Farhan Al Madri Al Fifi
King Fahd University of Petroleum and Minerals
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