Sun Jinliang

Investigation of the Curing Kinetics and Rheological Behavior of Multifunctional Epoxy Resin System

The curing reactivity and viscosity of AG-70 epoxy resin system with MNA as the curing agent and 2,4-EMI as the accelerator promoter were measured by using non-isothermal differential scanning calorimetry (DSC) and RS600 Rotational Rheometer, respectively. According to the DSC curves at different heating rates, the curing parameters such as the gelation temperature, the peak temperature and the treat temperature were obtained by using T-β curve extrapolation, the kinetic parameters of the curing reaction were determined by using Kissinger, Ozawa and Crane equation, including the apparent activation energy, the pre-exponential frequency and the curing reaction order. Then the kinetic model based on an nth order reaction equation was set up. The experimental data of the viscosity behavior were analyzed, and modified dual-Arrhenius viscosity model was established to predict the isothermal rheological behavior. The relationship between gel-time and temperature was also analyzed.