Sunao Mori

Development of ArF immersion exposure tool

Immersion lithography systems with a 193 nm light source are being pursued in the industry. This paper presents the results of the study we have made on various aspects of the exposure system, and gives the status of exposure system development together with the challenges involved. If there are fluctuations in the flow rate of immersion fluid, i.e. ultrapure water, the positioning accuracy of the wafer stage may be affected. Similarly, temperature changes in the fluid can significantly influence imaging performance of the projection optics. We have developed an ultrapure water supply control system which allows direct connection to the ultrapure water line of the existing fabs and enables constant-temperature, constant-flow rate control of the water with high stability. The evaluation results of this system will be shown. Photoresist materials such as photo-acid generator, PAG, dissolved into the water are a cause of concern for lens contamination. The challenge for exposure tool suppliers in terms of contamination control is to specify the permissible dissolution amount. To this end, wet contamination tests are in progress, and the findings to date will be discussed in this paper. Two verification tools for immersion exposure are built: a two-beam interference exposure tool and a full-field alpha-site scanner. Using the alpha tool, the evaluation results of full wafer CD uniformity including edge dies will be presented. Also, defect analysis results will be shown, specifically the impact of air bubbles on patterning.

Immersion exposure system using high-index materials

ArF water immersion systems with a numerical aperture (NA) of over 1.3 have already introduced for the node up to 45- nm half-pitch production. For the next generation of lithography, we focus on ArF immersion lithography using high-index materials. At present, LuAG (n=2.14) is the most promising candidate as a high-index lens material. Second-generation fluids (n=1.64) have the sufficient performance as a high-index immersion fluid. The combination of LuAG and a second-generation fluid can enhance the NA up to 1.55 and the exposure system would be available for the 34-nm half-pitch node when k1 is 0.27. Although high-index immersion lithography is attractive since it is effective in raising resolution, there are some issues not encountered in water immersion system. The issues of LuAG are its availability and the intrinsic birefringence. Fluid degradation induced by dissolved oxygen or laser irradiation, lens contamination, and residual fluid on a wafer are the specific issues of the immersion system. In this article, we introduce the current status for the above issues and discuss the feasibility of ArF immersion system using high-index materials.