Susumu Kuroyanagi

Fabrication of microdiaphragm pressure sensor utilizing micromachining

Abstract A newly structured microdiaphragm and its fabrication process have been developed utilizing micromachining (wafer direct bonding, preferential polishing of polysilicon, laser boring and anisotropic etching). This microdiaphragm has a pressure-inlet port perpendicularly bored from the reverse surface. By adapting this structure to the pressure sensor, different pressure measurements can be performed on a single chip. This microdiaphragm pressure sensor has a diaphragm that is smaller than 100 μm in size and allows itself to be installed anywhere on a chip. As an intelligent pressure sensor, it is advantageously integrated with a large-scale integrated circuit.