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Dive into the research topics where Susumu Sugano is active.

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Featured researches published by Susumu Sugano.


IEEE Transactions on Semiconductor Manufacturing | 2003

6-in diameter InP single crystals grown by the hot-wall LEC method and the mirror wafers

Koji Iwasaki; Kouji Sato; Koichiro Aoyama; Shinji Numao; Itsuro Honma; Susumu Sugano; Takaharu Hoshina; Takayuki Sato

6-in diameter Fe-doped semi-insulating InP single crystals have been grown by the hot-wall liquid encapsulated Czochralski method. This method has a quartz inner vessel to stabilize the thermal convection. Temperature gradient and solid-liquid interface shape can be controlled by a multizone heater system. The weight of grown crystal was 18 kg and the full length was 250 mm. The dislocation density was about 1/spl times/10/sup 5/ cm/sup -2/. The resistivity was more than 1/spl times/10/sup 7/ /spl Omega/cm and its uniformity was the same as the smaller diameter crystal. The conditions of wafer processing were optimized to improve the wafer flatness. The rolloff and the slope of the wafer surface could be reduced especially by the improvement of the polishing conditions. The typical total thickness variation was 3.3 /spl mu/m, and it was comparable to the GaAs wafer.


Archive | 2010

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT

Susumu Sugano


Archive | 2009

Method of manufacturing group-iii nitride semiconductor light-emitting device, and group-iii nitride semiconductor light-emitting device, and lamp

Susumu Sugano; Hisayuki Miki; Hironao Shinohara


Archive | 2010

METHOD FOR CUTTING SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT

Yoshiharu Saegusa; Susumu Sugano


Archive | 2009

Process for producing group iii nitride semiconductor light-emitting element, group iii nitride semiconductor light-emitting element, and lamp

Susumu Sugano; 菅野 進; Hisayuki Miki; 三木 久幸; Hironao Shinohara; 裕直 篠原


Archive | 2009

POLISHING APPARATUS, POLISHING AUXILIARY APPARATUS AND POLISHING METHOD

Susumu Sugano; 菅野 進


Archive | 2015

Verfahren zum Schneiden eines Substrats

Yoshiharu Saegusa; Susumu Sugano


Archive | 2010

A method for cutting a substrate, and method for manufacturing an electronic component

Yoshiharu Saegusa; Susumu Sugano


Archive | 2010

Verfahren zum Schneiden eines Substrats A method for cutting a substrate

Yoshiharu Saegusa; Susumu Sugano


Archive | 2009

Procédé de production d’un élément électroluminescent semi-conducteur en nitrure de groupe iii, élément électroluminescent semi-conducteur en nitrure de groupe iii et lampe

Susumu Sugano; 菅野 進; Hisayuki Miki; 三木 久幸; Hironao Shinohara; 裕直 篠原

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