Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Tai Wei-Chang is active.

Publication


Featured researches published by Tai Wei-Chang.


Archive | 2003

Flip chip semiconductor package

Lee Shih-Chang; Weng Gwo-Liang; Tai Wei-Chang; Lee Cheng-Yin


Archive | 2005

Stackable ball grid array package for multi chip module

Tai Wei-Chang; Chang Ching-Hui; Lee Shih-Chang; Lee Cheng-Yin


Archive | 2005

Stacked chip package structure and its manufacturing method

Chang Ching-Hui; Tai Wei-Chang; Weng Gwo-Liang; Lee Cheng-Yin


Archive | 2008

Chip package, stacked chip package structure and manufacture method of the same

Chuang Meng-Jung; Lee Cheng-Yin; Tai Wei-Chang; Chu Chi-Chih


Archive | 2007

Chip packaging process, substrate and chip package

Chuang Meng-Jung; Weng Gwo-Liang; Chu Chi-Chih; Tai Wei-Chang


Archive | 2007

Substrate structure having solder mask layer and process for making the same

Tai Wei-Chang; Chu Chi-Chih; Chuang Meng-Jung; Lee Cheng-Yin; Huang Yao-Ting; Lo Kuang Lin


Archive | 2005

Flip chip on chip package with improving bonding property of wire-connecting pads

Tai Wei-Chang; Lee Shih-Chang; Weng Gwo-Liang; Chang Ching-Hui


Archive | 2005

Method for improving balance of molding flow during assembling semiconductor packages with fail unit

Weng Gwo-Liang; Lee Shih-Chang; Tai Wei-Chang


Archive | 2004

System in package structures

Chang Ching-Hui; Lee Shih-Chang; Tai Wei-Chang; Weng Gwo-Liang; Lee Cheng-Yin


Archive | 2004

Manufacturing method for MCM package

Weng Gwo-Liang; Lee Shih-Chang; Tai Wei-Chang; Chang Ching-Hui

Collaboration


Dive into the Tai Wei-Chang's collaboration.

Researchain Logo
Decentralizing Knowledge