Takaki Yasuda

Light-emitting device, method of fabricating the device, and LED lamp using the device

LIGHT-EMITTING DIODE PACKAGE AND LEAD GROUP STRUCTURE FOR LIGHT-EMITTING DIODE PACKAGE

FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, PRINTED CIRCUIT BOARD FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, MOUNTING STRUCTURE FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DIODE LAMP

LIGHT EMITTING DEVICE AND METHOD FOR DRIVING LIGHT EMITTING DEVICE

COMPOSITION CONTAINING QUANTUM DOT FLUORESCENT BODY, MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN, STRUCTURE CONTAINING QUANTUM DOT FLUORESCENT BODY, LIGHT-EMITTING DEVICE, ELECTRONIC APPARATUS, MECHANICAL DEVICE, AND METHOD FOR PRODUCING MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN

Pn Junction Type Group III Nitride Semiconductor Light-Emitting Device

LIGHTING FIXTURE AND CEILING SYSTEM USING THE SAME

Flip-chip type semiconductor light-emitting device, method for manufacturing flip-chip type semiconductor light-emitting device

Method for production of group lll nitride semiconductor device

Pn junction type croup iii nitride semiconductor light-emitting device