Takara Sugimoto

A 10 Gbps x 12 channel pluggable optical transceiver for high-speed interconnections

We developed a 10 Gbps x 12 channel pluggable optical transceiver. It consists of three photoelectric devices, an FR4 substrate with a microcontroller, a 12 x 2 multimode fiber with three optical connectors for the three photoelectric devices, an electrical connector, and a heat sink. This transceiver can be vertically plugged to the motherboard by using electrical connector. A vertical plug enables the photoelectric conversion devices in the optical transceiver to be located close to the logic LSI on the motherboard at high density to prevent the waveform degrading. Moreover, it is possible to do prompt repairs if the transceiver breaks down because the module is pluggable. We demonstrated error-free operation after 50 m transmission over a GI/50 multimode fiber (MMF). These performance characteristics indicated that this optical transceiver is feasible for implementation in high- throughput interconnections.

Optical interconnection as an IP macro of a CMOS library

With the aim of producing a switch LSI with several-hundred-Gb/s-class throughput, we first developed LAN-LSIs with 10-Gb/s-class optical input/output (I/O) buffer. The optical I/O buffer was supplied as a set consisting of an optical-electrical package, soft or hard macros of the optical interface, and library files for a targeted CMOS technology. Using such library files, system LSI designers can implement an optical interface in their chips in a conventional design manner.

168 Gbps error-free demultiplexing with hybrid-integrated symmetric Mach-Zehnder all-optical switch

The symmetric Mach-Zehnder (SMZ) all-optical switch is quite promising for various types of future high-speed all-optical processing. We have developed a hybrid-integrated SMZ all-optical switch and achieved the error-free demultiplexing of 168 Gbps data pulses.

100-Gbps CMOS transceiver for multilane optical backplane system with a 1.3 cm 2 footprint

A compact 25-Gbps × 4-channel optical transceiver has been fabricated for optical backplane systems. Power consumption was as low as 20 mW/Gbps. A transmission experiment was successfully conducted at 25 Gbps.

A Small and Low Cost Bidirectional Transceiver Module with Polymer Waveguide for G-PON/GE-PON

We developed a bidirectional transceiver module with polymer waveguide to enable fabrication of compact and low-cost optical transceivers for gigabit or gigabit Ethernet passive optical networks (G-PON/GE-PON). The new module is compact and uses a polymer waveguide (planar lightwave circuit [PLC]). All the optical components, i.e., an optical fiber, Y-shaped polymer optical waveguides, photo detector (PD) chip, laser diode (LD) chip, and wavelength division multiplexing (WDM) filter, were mounted on the PLC platform using a passive alignment technique. We confirmed that the modules performance and reliability are sufficiently high for G-PON applications.

A low-cost, compact-size 10-Gigabit Ethernet optical sub-assembly using a novel opto-electronic hybrid integration platform

A novel opto-electronic hybrid integration platform using a flexible resin interposer on a silicon substrate has achieved low-cost, compact-size optical sub-assemblies. A 10 km error-free-transmission has been demonstrated with the optical sub-assemblies for 10-Gigabit Ethernet transceivers.

Technology for low-lost and high-volume optical device packaging

Hybrid integration of optical and electrical components (opt-electronic hybrid integration) leads to great progress in low cost and high volume optical packaging. We have developed various types of opt-electronic hybrid integration Tx/Rx module. Recently, demand for transmission speed is increasing up to 10 Gbps in Metro, LAN networks. A new packaging technique is now requested to realize lower cost and high speed. This paper presents the advance of the opt-electronic hybrid integration technology. A new packaging platform is proposed after revealing the present opt-electronic hybrid integration Tx/Rx module, and the prototype 10G-Ether modules are introduced as a trial