Takashi Sakuma | Researchain

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Featured researches published by Takashi Sakuma.

Archive | 2008

Sputtering method and sputtering apparatus

Kaoru Maekawa; Hiroyuki Nagai; Tatsuo Hatano; Takashi Sakuma

Archive | 2007

Film Forming Method, Plasma Film Forming Apparatus and Storage Medium

Takashi Sakuma; Taro Ikeda; Osamu Yokoyama; Tsukasa Matsuda; Tatsuo Hatano; Yasushi Mizusawa

Microelectronic Engineering | 2012

Bottom up deposition of advanced iPVD Cu process integrated with iPVD Ti and CVD Ru

Tadahiro Ishizaka; Takashi Sakuma; Masaya Kawamata; Osamu Yokoyama; Takara Kato; Atsushi Gomi; Chiaki Yasumuro; Hiroyuki Toshima; Toshihiko Fukushima; Yasushi Mizusawa; Tatsuo Hatano; Masamichi Hara

Archive | 2007

Film depositing method, plasma film forming device, and storage medium

Takashi Sakuma; Taro Ikeda; Osamu Yokoyama; Tsukasa Matsuda; Tatsuo Hatano; Yasushi Mizusawa

Archive | 2007

METHOD AND SYSTEM FOR IMPROVING SIDEWALL COVERAGE IN A DEPOSITION SYSTEM

Shigeru Mizuno; Takashi Sakuma; Yasushi Mizusawa

Archive | 2014

Copper Wiring Forming Method

Osamu Yokoyama; Cheonsoo Han; Takashi Sakuma; Chiaki Yasumuro; Tatsuo Hirasawa; Tadahiro Ishizaka; Kenji Suzuki

Archive | 2011

Methods of forming copper wiring and copper film, and film forming system

Tadahiro Ishizaka; Atsushi Gomi; Takara Kato; Osamu Yokoyama; Takashi Sakuma; Chiaki Yasumuro; Hiroyuki Toshima; Tatsuo Hatano; Yasushi Mizusawa; Masamichi Hara

Archive | 2012

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING COPPER FILM

Tadahiro Ishizaka; Atsushi Gomi; Takara Kato; Osamu Yokoyama; Takashi Sakuma; Chiaki Yasumuro; Hiroyuki Toshima; Tatsuo Hatano; Yasushi Mizusawa; Masamichi Hara; Kenzi Suzuki

Archive | 2007