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Takeshi Hozumi

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Publication

Featured researches published by Takeshi Hozumi.

Archive | 2002

Resin composition, prepreg, and printed wiring board therewith

Masataka Arai; Takayuki Baba; Takeshi Hozumi; Tatsuhiro Yoshida; 猛 八月朔日; 達弘 吉田; 政貴 新井; 孝幸 馬塲

Archive | 2010

Prepreg, substrate and semiconductor apparatus

Takayuki Baba; Takeshi Hozumi; Madoka Yuasa; 猛 八月朔日; 円 湯浅; 孝幸 馬塲

Archive | 2001

Resin composition, prepreg and printed circuit board using the same

Takayuki Baba; Takeshi Hozumi; Masako Okanuma; Kentaro Yabuki; 猛 八月朔日; 雅子 岡沼; 健太郎 矢吹; 孝幸 馬塲

Archive | 2001

Resin composition, prepreg and copper-clad laminated board using the same

Takayuki Baba; Takeshi Hozumi; Masako Okanuma; Kentaro Yabuki; 猛 八月朔日; 雅子 岡沼; 健太郎 矢吹; 孝幸 馬塲

Archive | 2005

Resin composite, insulation sheet with substrate and multilayer printed wiring board

Masataka Arai; Takeshi Hozumi; 猛 八月朔日; 政貴 新井

Archive | 2003

RESIN COMPOSITION AND SUBSTRATE USING THE SAME

Masataka Arai; Takayuki Baba; Tadasuke Endo; Takeshi Hozumi; Tatsuhiro Yoshida; 猛 八月朔日; 達弘 吉田; 政貴 新井; 忠相 遠藤; 孝幸 馬塲

Archive | 2003

Prepreg and printed circuit board using the same

Masataka Arai; Takayuki Baba; Takeshi Hozumi; Tatsuhiro Yoshida; 猛 八月朔日; 達弘 吉田; 政貴 新井; 孝幸 馬塲

Archive | 2010

Insulation sheet, insulation sheet with base material, and multilayer printed circuit board

Masataka Arai; Takayuki Baba; Takeshi Hozumi; Hiroaki Wakabayashi; 猛 八月朔日; 政貴 新井; 宏彰 若林; 孝幸 馬場

Archive | 2004

Resin composition, resin-laminated metallic foil and multilayer printed wiring board

Masataka Arai; Takayuki Baba; Takeshi Hozumi; Tatsuhiro Yoshida; 猛 八月朔日; 達弘 吉田; 政貴 新井; 孝幸 馬塲

Archive | 2004

Resin composition, prepreg and laminate sheet

Masataka Arai; Takayuki Baba; Tadasuke Endo; Takeshi Hozumi; 猛 八月朔日; 政貴 新井; 忠相 遠藤; 孝幸 馬場

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Collaboration

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